MT49H32M9FM-33 IT Micron Technology Inc, MT49H32M9FM-33 IT Datasheet - Page 16

• Manufacturer Part Number: MT49H32M9FM-33 IT
• Manufacturer: Micron Technology Inc
• Type: RLDRAMr

Specifications of MT49H32M9FM-33 IT

• Organization: 32Mx9
• Density: 288Mb
• Address Bus: 22b
• Maximum Clock Rate: 300MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: uBGA
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 609mA
• Pin Count: 144
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Not Compliant

Package Dimensions
Figure 6:
PDF: 09005aef80a41b46/Source: 09005aef809f284b
288Mb_RLDRAM_II_CIO_D2.fm - Rev. M 12/10 EN
Solder ball material:
Eutectic (62% Sn,
36% Pb, 2% Ag) or
SAC305 (96.5% Sn,
3% Ag, 0.5% Cu).
Dimensions apply to
solder balls post-reflow
on Ø0.39 SMD
ball pads.
144X Ø0.51
Seating
plane
17 CTR
0.12 A
144-Ball µBGA
1 TYP
Notes:
A
12 11 10 9
1. All dimensions are in millimeters.
10.6 CTR
0.8 TYP
8.8 CTR
11 ±0.1
288Mb: x9, x18, x36 2.5V V
10º TYP
4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
0.73 ±0.1
18.5 ±0.1
Ball A1 ID
16
Micron Technology, Inc., reserves the right to change products or specifications without notice.
EXT
18.1 CTR
, 1.8V V
0.34 MIN
0.49 ±0.05
1.2 MAX
DD
, HSTL, CIO, RLDRAM II
Package Dimensions
©2003 Micron Technology, Inc. All rights reserved.
Ball A1 ID