MT49H32M9FM-33 IT Micron Technology Inc, MT49H32M9FM-33 IT Datasheet - Page 32

• Manufacturer Part Number: MT49H32M9FM-33 IT
• Manufacturer: Micron Technology Inc
• Type: RLDRAMr

Specifications of MT49H32M9FM-33 IT

• Organization: 32Mx9
• Density: 288Mb
• Address Bus: 22b
• Maximum Clock Rate: 300MHz
• Operating Supply Voltage (typ): 1.8V
• Package Type: uBGA
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 609mA
• Pin Count: 144
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Not Compliant

Commands
Table 17:
Table 18:
PDF: 09005aef80a41b46/Source: 09005aef809f284b
RLDRAM_II_CIO_Core.fm - Rev. D 12/10 EN
Command
Operation
DSEL/NOP
MRS
READ
WRITE
AREF
Device DESELECT/no operation
MRS
READ
WRITE
AUTO REFRESH
Description of Commands
Command Table
Notes 1–2 apply to the entire table
The NOP command is used to perform a no operation to the RLDRAM, which essentially
deselects the chip. Use the NOP command to prevent unwanted commands from being
registered during idle or wait states. Operations already in progress are not affected.
Output values depend on command history.
The mode register is set via the address inputs A0–A17. See Figure 10 on page 34 for further
information. The MRS command can only be issued when all banks are idle and no other
operation is in progress.
The READ command is used to initiate a burst read access to a bank. The value on the BA0–
BA2 inputs selects the bank, and the address provided on inputs A0–An selects the data
location within the bank.
The WRITE command is used to initiate a burst write access to a bank. The value on the
BA0–BA2 inputs selects the bank, and the address provided on inputs A0–An selects the
data location within the bank. Input data appearing on the DQ is written to the memory
array subject to the DM input logic level appearing coincident with the data. If the DM
signal is registered LOW, the corresponding data will be written to memory. If the DM signal
is registered HIGH, the corresponding data inputs will be ignored (that is, this part of the
data word will not be written).
The AREF command is used during normal operation of the RLDRAM to refresh the memory
content of a bank. The command is nonpersistent, so it must be issued each time a refresh is
required. The value on the BA0–BA2 inputs selects the bank. The refresh address is
generated by an internal refresh controller, effectively making each address bit a “Don’t
Care” during the AREF command. See “AUTO REFRESH (AREF)” on page 41 for more details.
Notes:
Notes:
The following table provides descriptions of the valid commands of the RLDRAM. All
input states or sequences not shown are illegal or reserved. All command and address
inputs must meet setup and hold times around the rising edge of CK.
1. When the chip is deselected, internal NOP commands are generated and no commands are
2. n = 20.
1. X = “Don’t Care;” H = logic HIGH; L = logic LOW; A = valid address; BA = valid bank address.
2. n = 20.
3. Only A0–A17 are used for the MRS command.
4. Address width varies with burst length; see Table 20 on page 36 for details.
accepted.
288Mb: x9, x18, x36 2.5V V
DSEL/NOP
WRITE
Code
READ
AREF
MRS
CS#
Description
H
L
L
L
L
32
WE#
Micron Technology, Inc., reserves the right to change products or specifications without notice.
H
H
X
L
L
EXT
, 1.8V V
REF#
X
H
H
L
L
DD
OPCODE
A0–An
, HSTL, CIO, RLDRAM II
X
A
A
X
©2004 Micron Technology, Inc. All rights reserved.
2
BA0–BA2
BA
BA
BA
X
X
Commands
Notes
Notes
1
2
2
3
4
4