PIC18F24J10-I/ML Microchip Technology, PIC18F24J10-I/ML Datasheet - Page 221

IC PIC MCU FLASH 8KX16 28QFN

PIC18F24J10-I/ML

Manufacturer Part Number
PIC18F24J10-I/ML
Description
IC PIC MCU FLASH 8KX16 28QFN
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F24J10-I/ML

Core Size
8-Bit
Program Memory Size
16KB (8K x 16)
Core Processor
PIC
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
21
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
Controller Family/series
PIC18
No. Of I/o's
21
Ram Memory Size
1024Byte
Cpu Speed
40MHz
No. Of Timers
3
Interface
I2C, SPI, USART
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
1 KB
Interface Type
SPIC, I2C, EUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
21
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM183032, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 10 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164336 - MODULE SOCKET FOR PM3 28/44QFNAC162074 - HEADER INTRFC MPLAB ICD2 44TQFPAC162067 - HEADER INTRFC MPLAB ICD2 40/28P
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18F24J10-I/ML
Manufacturer:
VAC
Quantity:
23
After the A/D module has been configured as desired,
the selected channel must be acquired before the
conversion is started. The analog input channels must
have their corresponding TRIS bits selected as an
input. To determine acquisition time, see Section 18.1
“A/D Acquisition Requirements”. After this acquisi-
tion time has elapsed, the A/D conversion can be
started. An acquisition time can be programmed to
occur between setting the GO/DONE bit and the actual
start of the conversion.
The following steps should be followed to do an A/D
conversion:
1.
FIGURE 18-2:
© 2009 Microchip Technology Inc.
Configure the A/D module:
• Configure analog pins, voltage reference and
• Select A/D input channel (ADCON0)
• Select A/D acquisition time (ADCON2)
• Select A/D conversion clock (ADCON2)
• Turn on A/D module (ADCON0)
digital I/O (ADCON1)
Legend: C
V
AIN
R
S
V
I
R
SS
C
R
LEAKAGE
T
PIN
IC
HOLD
SS
ANALOG INPUT MODEL
ANx
C
5 pF
PIN
= Input Capacitance
= Threshold Voltage
= Leakage Current at the pin due to
= Interconnect Resistance
= Sampling Switch
= Sample/Hold Capacitance (from DAC)
= Sampling Switch Resistance
various junctions
V
DD
V
V
T
T
= 0.6V
= 0.6V
PIC18F45J10 FAMILY
I
±100 nA
LEAKAGE
2.
3.
4.
5.
6.
7.
R
IC
Configure A/D interrupt (if desired):
• Clear ADIF bit
• Set ADIE bit
• Set GIE bit
Wait the required acquisition time (if required).
Start conversion:
• Set GO/DONE bit (ADCON0<1>)
Wait for A/D conversion to complete, by either:
• Polling for the GO/DONE bit to be cleared
OR
• Waiting for the A/D interrupt
Read A/D Result registers (ADRESH:ADRESL);
clear bit, ADIF, if required.
For next conversion, go to step 1 or step 2, as
required. The A/D conversion time per bit is
defined as T
required before next acquisition starts.
≤ 1k
SS
Sampling
Switch
V
DD
AD
R
SS
. A minimum wait of 2 T
Sampling Switch
1
V
SS
C
2
HOLD
3
DS39682E-page 219
= 25 pF
(kΩ)
4
AD
is

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