EVAL-ADUC7023QSPZ Analog Devices Inc, EVAL-ADUC7023QSPZ Datasheet - Page 90

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EVAL-ADUC7023QSPZ

Manufacturer Part Number
EVAL-ADUC7023QSPZ
Description
KIT DEV FOR ADUC7023 QUICK START
Manufacturer
Analog Devices Inc
Type
MCUr
Datasheet

Specifications of EVAL-ADUC7023QSPZ

Contents
Board
Silicon Manufacturer
Analog Devices
Core Architecture
ARM
Core Sub-architecture
ARM7TDMI
Silicon Core Number
ADuC7023
For Use With/related Products
ARM7TDMI
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
ADuC7023
TYPICAL SYSTEM CONFIGURATION
A typical ADuC7023 configuration is shown in Figure 54. It summarizes some of the hardware considerations. The bottom of the LFCSP
package has an exposed pad that needs to be soldered to a metal plate on the board for mechanical reasons. The metal plate of the board
can be connected to ground.
PULL-UPs FOR I
Figure 54. Typical System Configuration
2
C PINS
Rev. B | Page 90 of 96
AV
GND
DAC0
DAC1
DAC2
DAC3
P0.4/IRQ0/SCL0/PLAI[0]/CONV
P0.5/SDA0/PLAI[1]/COMP
DD
REF
ADuC7023
OUT
P0.0/nTRST/ADC BUSY /PLAI[8]/BM
P0.3/PLAO[9]/TCK
P0.2/PLAO[8]/TDI
P0.1/PLAI[9]/TDO
XCLKO
XCLKI
RTCK
TMS

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