M68EVB908GB60E Freescale Semiconductor, M68EVB908GB60E Datasheet - Page 97

• Manufacturer Part Number: M68EVB908GB60E
• Description: BOARD EVAL FOR MC9S08GB60
• Manufacturer: Freescale Semiconductor
• Type: MCUr

Specifications of M68EVB908GB60E

• Contents: Module and Misc Hardware
• Processor To Be Evaluated: MC9S08GB
• Data Bus Width: 8 bit
• Interface Type: RS-232
• Silicon Manufacturer: Freescale
• Core Architecture: HCS08
• Core Sub-architecture: HCS08
• Silicon Core Number: MC9S08
• Silicon Family Name: S08GB
• Kit Contents: GB60 Evaluation Kit
• Rohs Compliant: Yes
• For Use With/related Products: MC9S08GB60
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Chapter 7 Internal Clock Generator (ICG) Module
The MC9S08GB/GT microcontroller provides one internal clock generation (ICG) module to create the
system bus frequency. All functions described in this section are available on the MC9S08GB/GT
microcontroller. The EXTAL and XTAL pins share port G bits 2 and 1, respectively. Analog supply lines
V
the ICG may be found in
Freescale Semiconductor
DDA
ICG
and V
SSA
ICGLCLK*
ICGERCLK
FFE
* ICGLCLK is the alternate BDC clock source for the MC9S08GB/GT.
Freescale Semiconductor recommends that FLASH location $FFBE be
reserved to store a nonvolatile version of ICGTRM. This will allow
debugger and programmer vendors to perform a manual trim operation and
store the resultant ICGTRM value for users to access at a later time.
ICGOUT
are internally derived from the MCU’s V
CPU
÷
CONTROL
2
SYSTEM
LOGIC
÷
Appendix A, “Electrical
2
FIXED FREQ CLOCK (XCLK)
Figure 7-1. System Clock Distribution Diagram
RTI
BUSCLK
MC9S08GB/GT Data Sheet, Rev. 2.3
BDC
TPM1
NOTE
Characteristics.”
TPM2
DD
and V
ATD has min and max
frequency requirements.
See
and
Characteristics.
IIC1
SS
Appendix A, “Electrical
Chapter 1,
ATD1
pins. Electrical parametric data for
SCI1
“Introduction”
RAM
SCI2
FLASH has frequency
requirements for program
and erase operation.
See
Characteristics.
FLASH
Appendix A, “Electrical
SPI1
97