C8051F336DK Silicon Laboratories Inc, C8051F336DK Datasheet - Page 26

• Manufacturer Part Number: C8051F336DK
• Description: DEV KIT FOR C8051F336
• Manufacturer: Silicon Laboratories Inc
• Type: MCUr

Specifications of C8051F336DK

• Contents: Evaluation Board, Power Supply, USB Cables, Adapter and Documentation
• Processor To Be Evaluated: C8051F33x
• Interface Type: USB, UART
• Operating Supply Voltage: 7 V to 15 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: C8051F336
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1430

C8051F336/7/8/9
26
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
Dimension
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This Land Pattern Design is based on the IPC-7351 guidelines.
3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used
5. The stencil thickness should be 0.125mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
7. A 2x2 array of 1.10mm x 1.10mm openings on a 1.30mm pitch should be used for the center
8. A No-Clean, Type-3 solder paste is recommended.
9. The recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for
C1
C2
X1
E
mask and the metal pad is to be 60μm minimum, all the way around the pad.
to assure good solder paste release.
pad.
Small Body Components.
Figure 5.2. QFN-24 Recommended PCB Land Pattern
Table 5.2. QFN-24 PCB Land Pattern Dimesions
3.90
3.90
0.20
Min
0.50 BSC
0.30
Max
4.00
4.00
Rev.1.0
Dimension
X2
Y1
Y2
2.70
0.65
2.70
Min
Max
2.80
0.75
2.80