PCF8576DT/2,118 NXP Semiconductors, PCF8576DT/2,118 Datasheet - Page 42

• Manufacturer Part Number: PCF8576DT/2,118
• Description: IC LCD DRIVER 40/160SEG 56TSSOP
• Manufacturer: NXP Semiconductors

Specifications of PCF8576DT/2,118

• Package / Case: 56-TSSOP
• Display Type: LCD
• Configuration: 40 Segment
• Interface: I²C
• Current - Supply: 24µA
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Number Of Digits: 20
• Number Of Segments: 160
• Maximum Clock Frequency: 400 KHz
• Operating Supply Voltage: 1.8 V to 5.5 V
• Maximum Power Dissipation: 400 mW
• Maximum Operating Temperature: + 85 C
• Maximum Supply Current: 50 mA
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 568-4703 - DEMO BOARD LCD GRAPHIC DRIVER
• Digits Or Characters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-3558-2; 935276166118; PCF8576DT/2-T

NXP Semiconductors
18. Soldering of SMD packages
PCF8576D
Product data sheet
17.2 Carrier tape information
18.1 Introduction to soldering
18.2 Wave and reflow soldering
Table 24.
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Symbol
A0
B0
K0
P1
W
Fig 29. Tape details
W
pin 1 index
Carrier tape dimensions
B0
All information provided in this document is subject to legal disclaimers.
Description
pocket width in x direction
pocket width in y direction
pocket height
sprocket hole pitch
tape width in y direction
Rev. 10 — 14 February 2011
4
direction of feed
Universal LCD driver for low multiplex rates
P1
A0
PCF8576D
Value
8.6
14.5
1.8
12
24
© NXP B.V. 2011. All rights reserved.
001aaj314
K0
Unit
mm
mm
mm
mm
mm
42 of 50