MK21DN512VMC5 Freescale Semiconductor, MK21DN512VMC5 Datasheet - Page 21

• Manufacturer Part Number: MK21DN512VMC5
• Description: ARM Microcontrollers - MCU ARM+512Kb+USB+DryIce
• Manufacturer: Freescale Semiconductor

Specifications of MK21DN512VMC5

• Core: ARM Cortex M4
• Processor Series: MK21DN512
• Data Bus Width: 16 bit/32 bit
• Maximum Clock Frequency: 50 MHz
• Program Memory Size: 512 KB
• Data Ram Size: 64 KB
• On-chip Adc: Yes
• Operating Supply Voltage: 1.71 V to 3.6 V
• Operating Temperature Range: - 40 C to + 105 C
• Package / Case: MAPBGA-121
• Mounting Style: SMD/SMT
• A/d Bit Size: 16 bit
• Interface Type: Serial
• Length: 8 mm
• Maximum Operating Temperature: + 105 C
• Minimum Operating Temperature: - 40 C
• Number Of Timers: 2
• On-chip Dac: Yes
• Program Memory Type: Flash
• Supply Voltage - Max: 3.6 V
• Supply Voltage - Min: 1.71 V

1.
2.
3.
4.
5.
6.
6 Peripheral operating requirements and behaviors
6.1 Core modules
6.1.1 JTAG electricals
Freescale Semiconductor, Inc.
Symbol
J10
J11
J1
J2
J3
J4
J5
J6
J7
J8
J9
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air) with the single layer board horizontal. For the LQFP, the board meets the
JESD51-3 specification. For the MAPBGA, the board meets the JESD51-9 specification.
Determined according to JEDEC Standard JESD51-6, Integrated Circuits Thermal Test Method Environmental
Conditions—Forced Convection (Moving Air) with the board horizontal.
Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental
Conditions—Junction-to-Board. Board temperature is measured on the top surface of the board near the package.
Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate
temperature used for the case temperature. The value includes the thermal resistance of the interface material
between the top of the package and the cold plate.
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air).
Operating voltage
TCLK frequency of operation
TCLK cycle period
TCLK clock pulse width
TCLK rise and fall times
Boundary scan input data setup time to TCLK rise
Boundary scan input data hold time after TCLK rise
TCLK low to boundary scan output data valid
TCLK low to boundary scan output high-Z
TMS, TDI input data setup time to TCLK rise
TMS, TDI input data hold time after TCLK rise
TCLK low to TDO data valid
Description
• Boundary Scan
• JTAG and CJTAG
• Serial Wire Debug
• Boundary Scan
• JTAG and CJTAG
• Serial Wire Debug
Table 12. JTAG limited voltage range electricals
K21 Sub-Family Data Sheet Data Sheet, Rev. 3, 08/2012.
Table continues on the next page...
Peripheral operating requirements and behaviors
1/J1
Min.
2.7
50
20
10
20
—
—
—
—
0
0
0
0
8
1
Max.
3.6
10
25
50
25
25
17
—
—
—
—
—
—
—
—
3
MHz
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
V
21