MK21DN512VMC5 Freescale Semiconductor, MK21DN512VMC5 Datasheet - Page 20

• Manufacturer Part Number: MK21DN512VMC5
• Description: ARM Microcontrollers - MCU ARM+512Kb+USB+DryIce
• Manufacturer: Freescale Semiconductor

Specifications of MK21DN512VMC5

• Core: ARM Cortex M4
• Processor Series: MK21DN512
• Data Bus Width: 16 bit/32 bit
• Maximum Clock Frequency: 50 MHz
• Program Memory Size: 512 KB
• Data Ram Size: 64 KB
• On-chip Adc: Yes
• Operating Supply Voltage: 1.71 V to 3.6 V
• Operating Temperature Range: - 40 C to + 105 C
• Package / Case: MAPBGA-121
• Mounting Style: SMD/SMT
• A/d Bit Size: 16 bit
• Interface Type: Serial
• Length: 8 mm
• Maximum Operating Temperature: + 105 C
• Minimum Operating Temperature: - 40 C
• Number Of Timers: 2
• On-chip Dac: Yes
• Program Memory Type: Flash
• Supply Voltage - Max: 3.6 V
• Supply Voltage - Min: 1.71 V

General
1. This is the minimum pulse width that is guaranteed to pass through the pin synchronization circuitry. Shorter pulses may or
2. The greater synchronous and asynchronous timing must be met.
3. This is the minimum pulse width that is guaranteed to be recognized as a pin interrupt request in Stop, VLPS, LLS, and
4. 75pF load
5. 15pF load
5.4 Thermal specifications
5.4.1 Thermal operating requirements
5.4.2 Thermal attributes
20
Single-layer (1s)
Four-layer (2s2p)
Single-layer (1s)
Four-layer (2s2p)
—
—
—
Board type
may not be recognized. In Stop, VLPS, LLS, and VLLSx modes, the synchronizer is bypassed so shorter pulses can be
recognized in that case.
VLLSx modes.
Symbol
T
T
J
A
Die junction temperature
Ambient temperature
Description
R
R
R
R
R
R
Ψ
Symbol
θJA
θJA
θJMA
θJMA
θJB
θJC
JT
K21 Sub-Family Data Sheet Data Sheet, Rev. 3, 08/2012.
Table 11. Thermal operating requirements
Thermal resistance,
junction to ambient
(natural convection)
Thermal resistance,
junction to ambient
(natural convection)
Thermal resistance,
junction to ambient
(200 ft./min. air speed)
Thermal resistance,
junction to ambient
(200 ft./min. air speed)
Thermal resistance,
junction to board
Thermal resistance,
junction to case
Thermal
characterization
parameter, junction to
package top outside
center (natural
convection)
Description
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Min.
–40
–40
Freescale Semiconductor, Inc.
Max.
125
105
1,
1,
1,3
1,3
4
5
6
Notes
2
3
Unit
°C
°C