SSTUG32868ET/G,518 NXP Semiconductors, SSTUG32868ET/G,518 Datasheet - Page 27

• Manufacturer Part Number: SSTUG32868ET/G,518
• Description: IC BUFFER 1.8V 25BIT 176-LFBGA
• Manufacturer: NXP Semiconductors

Specifications of SSTUG32868ET/G,518

• Logic Type: 1:2 Configurable Registered Buffer with Parity
• Supply Voltage: 1.7 V ~ 2 V
• Number Of Bits: 28
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 176-TFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935284276518; SSTUG32868ET/G-T; SSTUG32868ET/G-T

NXP Semiconductors
14. Abbreviations
15. Revision history
Table 15.
SSTUG32868_1
Product data sheet
Document ID
SSTUG32868_1
Revision history
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
Table 14.
Acronym
CMOS
DDR2
DIMM
DRAM
LVCMOS
PRR
RDIMM
SSTL
Fig 24. Temperature profiles for large and small components
Release date
20070423
MSL: Moisture Sensitivity Level
temperature
Abbreviations
Description
Complementary Metal Oxide Semiconductor
Double Data Rate 2
Dual In-line Memory Module
Dynamic Random Access Memory
Low Voltage Complementary Metal Oxide Semiconductor
Pulse Repetition Rate
Registered Dual In-line Memory Module
Stub Series Terminated Logic
Data sheet status
Product data sheet
Rev. 01 — 23 April 2007
= minimum soldering temperature
1.8 V DDR2-1G configurable registered buffer with parity
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
Change notice
-
SSTUG32868
temperature
Supersedes
-
peak
© NXP B.V. 2007. All rights reserved.
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