SSTUG32868 NXP Semiconductors, SSTUG32868 Datasheet

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SSTUG32868

Manufacturer Part Number
SSTUG32868
Description
Sstug32868 1.8 V 28-bit 1 2 Configurable Registered Buffer With Parity For Ddr2-1g Rdimm Applications
Manufacturer
NXP Semiconductors
Datasheet

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Part Number:
SSTUG32868ET/G,518
Manufacturer:
NXP Semiconductors
Quantity:
10 000
Part Number:
SSTUG32868ET/S,518
Manufacturer:
NXP Semiconductors
Quantity:
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1. General description
2. Features
The SSTUG32868 is a 1.8 V 28-bit 1 : 2 register specifically designed for use on two rank
by four (2R
is similar in function to the JEDEC-standard 14-bit DDR2 register, but integrates the
functionality of the normally required two registers in a single package, thereby freeing up
board real-estate and facilitating routing to accommodate high-density Dual In-line
Memory Module (DIMM) designs.
The SSTUG32868 also integrates a parity function, which accepts a parity bit from the
memory controller, compares it with the data received on the D-inputs and indicates
whether a parity error has occurred on its open-drain QERR pin (active LOW).
It further offers added features over the JEDEC standard register in that it is permanently
configured for high output drive strength. This allows use in high density designs with
heavier than normal net loading conditions. Furthermore, the SSTUG32868 features two
additional chip select inputs, which allow more versatile enabling and disabling in densely
populated memory modules. Both added features (drive strength and chip selects) are
fully backward compatible to the JEDEC standard register. Finally, the SSTUG32868 is
optimized for the fastest propagation delay in the SSTU family of registers.
The SSTUG32868 is packaged in a 176-ball, 8
fine-pitch ball grid array (TFBGA) package, which (while requiring a minimum
6 mm
conventional card technology.
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SSTUG32868
1.8 V 28-bit 1 : 2 configurable registered buffer with parity for
DDR2-1G RDIMM applications
Rev. 01 — 23 April 2007
28-bit data register supporting DDR2
Fully compliant to JEDEC standard for SSTUB32868
Supports 2 rank by 4 DIMM density by integrating equivalent functionality of two
JEDEC-standard DDR2 registers (that is, 2
Parity checking function across 22 input data bits
Parity out signal
Controlled multi-impedance output impedance drivers enable optimal signal integrity
and speed
Meets or exceeds SSTUB32868 JEDEC standard speed performance
Supports up to 450 MHz clock frequency of operation
Permanently configured for high output drive
Optimized pinout for high-density DDR2 module design
Chip-selects minimize power consumption by gating data outputs from changing state
15 mm of board space) allows for adequate signal routing and escape using
4) and similar high-density Double Data Rate 2 (DDR2) memory modules. It
SSTUA32864 or 2
22 grid, 0.65 mm ball pitch, thin profile
Product data sheet
SSTUA32866)

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SSTUG32868 Summary of contents

Page 1

... DDR2-1G RDIMM applications Rev. 01 — 23 April 2007 1. General description The SSTUG32868 is a 1.8 V 28-bit register specifically designed for use on two rank by four (2R is similar in function to the JEDEC-standard 14-bit DDR2 register, but integrates the functionality of the normally required two registers in a single package, thereby freeing up board real-estate and facilitating routing to accommodate high-density Dual In-line Memory Module (DIMM) designs ...

Page 2

... SSTUG32868ET/S Pb-free (SnAgCu solder ball compound) 4.1 Ordering options Table 2. Type number SSTUG32868ET/G SSTUG32868ET/S SSTUG32868_1 Product data sheet 1.8 V DDR2-1G configurable registered buffer with parity 15 mm, 0.65 mm ball pitch TFBGA package Package Name Description TFBGA176 plastic thin fine-pitch ball grid array package; ...

Page 3

... VREF DCKE0, DCKE1 DODT0, DODT1 DCS0 CSGEN DCS1 DCS2 DCS3 (1) Register A configuration ( D5, D7 D12, D17 to D28 Fig 1. Logic diagram of SSTUG32868 (positive logic) SSTUG32868_1 Product data sheet 1.8 V DDR2-1G configurable registered buffer with parity SSTUG32868 ...

Page 4

... Register B configuration ( D12, D17 to D20, D22, D24 to D28 Register B configuration (C = 1): Q1A to Q12A, Q17A to Q20A, Q22A, Q24A to Q28A Register B configuration (C = 1): Q1B to Q12B, Q17B to Q20B, Q22B, Q24B to Q28B Rev. 01 — 23 April 2007 SSTUG32868 PARITY GENERATOR ...

Page 5

... V DDR2-1G configurable registered buffer with parity SSTUG32868ET/G SSTUG32868ET/S ball A1 index area 002aac916 Transparent top view Rev. 01 — 23 April 2007 SSTUG32868 © NXP B.V. 2007. All rights reserved ...

Page 6

... Q21A GND D20 Q23A V DD D21 D22 GND D23 D24 V DD D25 D26 GND D27 D28 SELDR 176-ball grid; top view. Rev. 01 — 23 April 2007 SSTUG32868 GND VREF GND Q1A Q2A GND GND GND Q3A ...

Page 7

... D20 V DD (QCKE1A) D21 D22 GND (DCKE0) D23 D24 V DD (DCKE1) D25 D26 GND D27 D28 SELDR 176-ball grid; top view. Rev. 01 — 23 April 2007 SSTUG32868 GND VREF GND Q1A Q2A GND GND GND Q3A ...

Page 8

... Y8, AA8, AB8 N2 1.8 V CMOS M7 outputs P2 M8 Rev. 01 — 23 April 2007 SSTUG32868 Description The outputs of this register will not be suspended by the DCS0 and DCS1 control. The outputs of this register will not be suspended by the DCS0 and DCS1 control. Data inputs, clocked in on the crossing of the rising edge of CK and the falling edge of CK ...

Page 9

... H4, H5, H6, K4, K5, K6, M4, M5, M6, P4, P5, P6, T3, T4, T5, T6, V3, V4, V5, V6, Y3, Y4, Y5, Y6, AB4, AB6 Rev. 01 — 23 April 2007 SSTUG32868 Description Data outputs that will not be suspended by the DCS0 and DCS1 control. Data outputs that will not be suspended by the DCS0 and DCS1 control. ...

Page 10

... floating floating floating Rev. 01 — 23 April 2007 SSTUG32868 Type Description ground Ground. input LVCMOS Selects output drive strength: ‘HIGH’ for input with normal drive; ‘LOW’ for high drive. This weak pin will default HIGH if left open-circuit pull-up (built-in weak pull-up resistor) ...

Page 11

... LPM and the QERR output is driven LOW, it stays latched LOW for the LPM duration plus two clock cycles or until RESET is driven LOW. 7.2 Functional information The SSTUG32868 is a 28-bit configurable registered buffer designed for 1 1 All inputs are compatible with the JEDEC standard for SSTL_18, except the chip-select gate-enable (CSGEN), control (C), and reset (RESET) inputs, which are LVCMOS ...

Page 12

... NXP Semiconductors during the time from the LOW-to-HIGH transition of RESET until the input receivers are fully enabled, the design of the SSTUG32868 must ensure that the outputs will remain LOW, thus ensuring no glitches on the output. The SSTUG32868 includes a parity checking function. Parity, which arrives one cycle after the data input to which it applies, is checked on the PAR_IN input of the device ...

Page 13

... V DDR2-1G configurable registered buffer with parity ACT PDM PDMSS QERR data to QERR latency HIGH or LOW Rev. 01 — 23 April 2007 SSTUG32868 PHL PHL PLH CK to QERR © NXP B.V. 2007. All rights reserved 002aab899 ...

Page 14

... PDM PDMSS data to QERR latency output signal is dependent on the prior unknown event Rev. 01 — 23 April 2007 SSTUG32868 PHL PLH CK to QERR HIGH or LOW © NXP B.V. 2007. All rights reserved. 4 002aab900 ...

Page 15

... Fig 8. Timing diagram during shutdown (RESET switches from HIGH to LOW) SSTUG32868_1 Product data sheet 1.8 V DDR2-1G configurable registered buffer with parity t INACT t PHL RESET PLH RESET to QERR HIGH, LOW, or Don't care . Rev. 01 — 23 April 2007 SSTUG32868 HIGH or LOW 002aac511 © NXP B.V. 2007. All rights reserved ...

Page 16

... Human Body Model (HBM); 1 100 pF Machine Model (MM 200 pF Conditions [1] Dn and PAR_IN inputs [1] Dn and PAR_IN inputs [1] [1] Dn and PAR_IN inputs [2] RESET, CSGEN [2] RESET, CSGEN CK, CK CK, CK operating in free air SSTUG32868ET/G SSTUG32868ET/S Rev. 01 — 23 April 2007 SSTUG32868 Min Max 0.5 +2.5 [1][2] 0.5 +2.5 [1][ ...

Page 17

... Dn, CSGEN, PAR_IN inputs 250 mV 1 ref DD DCSn 0 600 mV; ICR 1 and CK 0 600 mV; ICR 1 RESET GND 1 instantaneous steady-state Rev. 01 — 23 April 2007 SSTUG32868 Min Typ Max ...

Page 18

... CK and from CK and CK to QERR from RESET to QERR from CK and CK to QERR from RESET to Qn from CK and Conditions from from (from (from Rev. 01 — 23 April 2007 SSTUG32868 Min Typ Max - - 450 [1][2] - ...

Page 19

... 250 mV (AC voltage levels) for differential inputs ref 250 mV (AC voltage levels) for differential inputs ref Rev. 01 — 23 April 2007 SSTUG32868 = 50 ; input slew rate = 1 V/ns 0 DUT delay = 350 OUT ( 0. ...

Page 20

... PLH PHL 250 mV (AC voltage levels) for differential inputs ref 250 mV (AC voltage levels) for differential inputs ref Rev. 01 — 23 April 2007 SSTUG32868 V V ICR ref V IL 002aaa374 = V for LVCMOS inputs. ...

Page 21

... V DDR2-1G configurable registered buffer with parity 0 input slew rate = 1 V/ns 0 DUT OUT includes probe and jig capacitance. L output dv_f DUT OUT includes probe and jig capacitance. L dv_r output Rev. 01 — 23 April 2007 SSTUG32868 20 %, unless otherwise specified test point ( 002aaa377 ...

Page 22

... L LVCMOS RESET 0.5V t PLH output waveform 2 RESET input timing V ICR inputs t PHL output waveform 1 to clock inputs Rev. 01 — 23 April 2007 SSTUG32868 20 %, unless otherwise specified test point ( 002aaa500 0.15 V ...

Page 23

... Fig 22. Voltage waveforms, open-drain output LOW-to-HIGH transition time with respect to SSTUG32868_1 Product data sheet 1.8 V DDR2-1G configurable registered buffer with parity timing V ICR inputs t PLH output waveform 2 clock inputs Rev. 01 — 23 April 2007 SSTUG32868 V V i(p-p) ICR 002aab907 © NXP B.V. 2007. All rights reserved ...

Page 24

... 6.1 15.1 0.65 4.55 13.65 0.15 5.9 14.9 REFERENCES JEDEC JEITA MO-246 - - - Rev. 01 — 23 April 2007 SSTUG32868 detail 0.08 0.1 0.1 EUROPEAN PROJECTION SOT932-1 ISSUE DATE 06-01-11 06-01-16 © NXP B.V. 2007. All rights reserved ...

Page 25

... Solder bath specifications, including temperature and impurities SSTUG32868_1 Product data sheet 1.8 V DDR2-1G configurable registered buffer with parity Rev. 01 — 23 April 2007 SSTUG32868 © NXP B.V. 2007. All rights reserved ...

Page 26

... Lead-free process (from J-STD-020C) Package reflow temperature ( C) 3 Volume (mm ) < 350 260 260 250 Figure 24. Rev. 01 — 23 April 2007 SSTUG32868 Figure 24) than a PbSn process, thus 350 220 220 350 to 2000 > 2000 260 260 250 245 245 245 © NXP B.V. 2007. All rights reserved. ...

Page 27

... Dynamic Random Access Memory Low Voltage Complementary Metal Oxide Semiconductor Pulse Repetition Rate Registered Dual In-line Memory Module Stub Series Terminated Logic Data sheet status Product data sheet Rev. 01 — 23 April 2007 SSTUG32868 peak temperature 001aac844 Change notice Supersedes - - © NXP B.V. 2007. All rights reserved. ...

Page 28

... Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. http://www.nxp.com salesaddresses@nxp.com Rev. 01 — 23 April 2007 SSTUG32868 © NXP B.V. 2007. All rights reserved ...

Page 29

... Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2007. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com SSTUG32868 All rights reserved. Date of release: 23 April 2007 Document identifier: SSTUG32868_1 ...

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