M52S64322A-10BG ESMT [Elite Semiconductor Memory Technology Inc.], M52S64322A-10BG Datasheet - Page 25
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M52S64322A-10BG
Manufacturer Part Number
M52S64322A-10BG
Description
512K x 32 Bit x 4 Banks Mobile Synchronous DRAM
Manufacturer
ESMT [Elite Semiconductor Memory Technology Inc.]
Datasheet
1.M52S64322A-10BG.pdf
(47 pages)
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ESMT
12. About Burst Type Control
13. About Burst Length Control
Elite Semiconductor Memory Technology Inc.
Random
Random
Interrupt
MODE
MODE
MODE
MODE
MODE
Basic
Basic
Random Column Access
(Interrupted by
RAS Interrupt
CAS Interrupt
Sequential Counting
Precharge)
Interleave Counting
Burst Stop
Full Page
t
CCD
1
2
4
8
= 1 CLK
At MRS A210 = “000”
At auto precharge. t
At MRS A210 = “001”
At auto precharge. t
At MRS A210 = “010”
At MRS A210 = “011”
At MRS A210 = “111”
At the end of the burst length, burst is warp-around.
t
Using burst stop command, any burst length control is possible.
During read/write burst with auto precharge, CAS interrupt can not be issued.
Before the end of burst. Row precharge command of the same bank stops read /write burst
with auto precharge.
t
During read/write burst with auto precharge, RAS interrupt can not be issued.
Before the end of burst, new read/write stops read/write burst and starts new read/write
burst.
BDL
RDL
= 1, Valid DQ after burst stop is 1, 2 for CAS latency 2, 3 respectively.
= 2clk with DQM , Valid DQ after burst stop is 1, 2 for CAS latency 2, 3 respectively.
At MRS A3 = “0”. See the BURST SEQUENCE TABLE. (BL = 4,8)
BL = 1, 2, 4, 8 and full page.
At MRS A3 = “1”. See the BURST SEQUENCE TABLE. (BL = 4,8)
BL = 4, 8 At BL =1, 2 interleave Counting = Sequential Counting
Every cycle Read/Write Command with random column address can realize
Random Column Access.
That is similar to Extended Data Out (EDO) Operation of conventional DRAM.
RAS
RAS
should not be violated.
should not be violated.
Publication Date: Aug. 2009
Revision: 1.3
M52S64322A
25/47
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