AMD-X5-133ADW AMD [Advanced Micro Devices], AMD-X5-133ADW Datasheet - Page 65

• Manufacturer Part Number: AMD-X5-133ADW
• Manufacturer: AMD [Advanced Micro Devices]

12
The Am5
when T
of 0 C to +55 C or +85 C. T
any environment to determine whether the Am5
croprocessor is within specified operating range. The
case temperature should be measured at the center of
the top surface opposite the pins.
The ambient temperature (T
not violated. The ambient temperature can be calculated
from
T
T
T
Note:
*0.350 high unidirectional heat sink (Al alloy 6063-T5, 40 mil fin width, 155 mil center-to-center fin spacing)
J
A
CASE
T
T
T
T
T
T
= T
Cooling
Mechanism
No Heat Sink
Heat Sink*
Heat Sink* and fan
T
A
A
A
A
A
A
= T
A
with Heat Sink and fan
with Heat Sink and fan
without Heat Sink
with Heat Sink
without Heat Sink
with Heat Sink
by Cooling Type
CASE
J
= T
JC
– (P •
Table 21. Thermal Resistance (°C/W)
PACKAGE THERMAL
SPECIFICATIONS
CASE
and
A
X
+ (P •
+ (P • [
86 microprocessor is specified for operation
(the case temperature) is within the range
JA
JA
)
JC
and from the following equations:
JA
)
–
JC
1.5
2.0
2.0
Table 23. Maximum T
JC
])
T
55 C
55 C
55 C
85 C
85 C
85 C
CASE
A
CASE
) is guaranteed if T
T
85 C
CASE
Table 22. Maximum T
can be measured in
JA
Clock
133 MHz
133 MHz
133 MHz
133 MHz
133 MHz
133 MHz
16.5
12.0
5.0
vs. Airflow-Linear ft/min. (m/s)
(0)
0
Am5
A
X
JC
86 mi-
CASE
for SQFP Package by Clock Frequency
X
PRELIMINARY
Airflow-Linear ft/min. (m/sec)
8.9 C
24.3 C
45.8 C
38.9 C
54.3 C
75.8 C
86 Microprocessor
and
(1.01)
14.0
(0)
is
200
0
133 MHz
7.0
4.6
Clock
A
JA
at Various Airflows in C
for the Am5
Where:
T
P
The values for
1.75 sq. in., 168-pin, ceramic PGA. For the 208-pin
SQFP plastic package,
Table 22 shows the T
T
package. Note that T
a heat sink to the package. P (the maximum power con-
sumption) is calculated by using a maximum I
of 931 mA at 3.3 V. Table 23 shows the T
(without exceeding T
a maximum I
JC
16.6 C
39.6 C
47.0 C
46.6 C
69.6 C
77.0 C
J
CASE
(1.01)
, T
,
200
A
JA
, T
) at various airflows and T
(2.03)
12.0
400
5.0
4.2
CASE
X
22.7 C
45.8 C
48.2 C
52.7 C
75.8 C
78.2 C
86 CPU in 168-Pin PGA Package
(2.03)
CC
= Junction, Ambient, and Case Temperature
= Junction-to-Case and Junction-to-Ambient
= Maximum Power Consumption
400
Thermal Resistance, respectively
value of 931 mA at 3.3 V.
JA
46.6 C
and
(3.04)
10.5
600
4.0
3.8
T
CASE
A
A
is greatly improved by attaching
A
27.3 C
48.9 C
49.5 C
57.3 C
78.9 C
79.5 C
(3.04)
JC
allowable (without exceeding
) for the SQFP package using
600
JA
are given in Table 21 for the
= 14.0 and
CASE
(4.06)
800
9.5
3.5
3.5
30.4 C
50.4 C
50.4 C
60.4 C
80.4 C
80.4 C
(4.06)
values for the PGA
800
JC
= 1.5.
A
AMD
allowable
32.0 C
51.2 C
51.2 C
62.0 C
81.2 C
81.2 C
(5.07)
1000
CC
3.25
3.25
(5.07)
9.0
1000
value
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