AMD-K6-2E/400AFR AMD [Advanced Micro Devices], AMD-K6-2E/400AFR Datasheet - Page 311

• Manufacturer Part Number: AMD-K6-2E/400AFR
• Manufacturer: AMD [Advanced Micro Devices]

22529B/0—January 2000
Soldered Installation:
Case-to-Ambient
Thermal Resistance
.
Table 71. Soldered CPGA Package: Measured Thermal Resistance (°C/W) q
Figure 107. Measured Thermal Resistance v. Airflow (Soldered 321-Pin CPGA Package)
Chapter 16
Heatsink Type
No Heatsink
A (15 mm)
B (20 mm)
C (30 mm)
8
7
6
5
4
3
2
1
0
0
q
Table 71 and Figure 107 show the measured values for the case-
to-ambient thermal resistance (q
levels of airflow in the system for the low-power embedded
AMD-K6-2E processors with a maximum thermal power
dissipation of 10.0 watts (OPNs: AMD-K6-2E/266AMZ,
AM D-K6 -2E/ 300 AMZ , and AMD - K6 -2 E/ 33 3A MZ) and a
maximum case temperature rating of 85
Ceramic Pin Grid Array package (CPGA) when soldered into a
printed circuit board.
JC
(°C/W)
1.0
1.0
1.0
1.0
1
Airflow Rate (m/s)
0.0 m/s
7.0
5.2
4.9
4.3
Thermal Design
2
1.0 m/s
5.2
2.9
3.4
2.5
q
CA
3
(°C/W) v. Airflow (m/s)
2.0 m/s
4.2
2.0
2.4
1.6
CA
AMD-K6™-2E Processor Data Sheet
4
in
JC
°
and q
C/watt) at different
3.0 m/s
°
C, in the 321-pin
3.3
1.5
1.4
1.9
CA
4.0 m/s
2.7
1.3
1.7
1.2
293