k4b2g0846b Samsung Semiconductor, Inc., k4b2g0846b Datasheet - Page 10
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k4b2g0846b
Manufacturer Part Number
k4b2g0846b
Description
2gb B-die Ddr3 Sdram Specification
Manufacturer
Samsung Semiconductor, Inc.
Datasheet
1.K4B2G0846B.pdf
(61 pages)
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K4B2G04(08/16)46B
3.5 FBGA Package Dimension (x16)
(Datum B)
(Post Reflow ∅0.50 ± 0.05)
(Datum A)
96 - ∅0.45 Solder ball
0.2
#A1
G
M
A
B
C
D
E
F
H
K
N
P
R
T
J
L
M
A B
9
0.80
8 7 6 5 4 3 2 1
BOTTOM VIEW
0.80 x 8 = 6.40
TOP VIEW
9.00 ± 0.10
9.00 ± 0.10
1.60
(1.90)
Page 10 of 61
(0.95)
3.20
MOLDING AREA
A
#A1 INDEX MARK
B
2Gb DDR3 SDRAM
Rev. 1.0 December 2008
1.10 ± 0.10
0.35 ± 0.05
Units : Millimeters