am45dl3208g Advanced Micro Devices, am45dl3208g Datasheet - Page 9

• Manufacturer Part Number: am45dl3208g
• Description: Stacked Multi-chip Package Mcp Flash Memory And Sram
• Manufacturer: Advanced Micro Devices

CONNECTION DIAGRAM
Special Package Handling Instructions
Special handling is required for Flash Memory products
in molded packages (TSOP, BGA, PDIP, SSOP, PLCC).
March 12, 2004
G1
M1
A1
B1
C1
NC
NC
NC
F1
NC
NC
L1
NC
NC
CE1#s
CE#f
D2
G2
H2
E2
F2
J2
A3
A2
A1
A0
OE#
DQ0
DQ8
G3
V
C3
D3
E3
H3
K3
A7
F3
J3
A6
A5
A4
SS
DQ10
DQ1
DQ9
DQ2
UB#
LB#
A18
A17
C4
D4
G4
H4
E4
F4
K4
J4
WP#/ACC
RESET#
RY/BY#
DQ11
V
DQ3
B5
C5
H5
NC
D5
L5
NC
E5
J5
K5
CC
f
P R E L I M I N A R Y
CE2s
V
CIOs
WE#
DQ4
D6
A20
C6
H6
B6
E6
K6
NC
J6
L6
NC
CC
73-Ball FBGA
Am45DL3208G
s
Top View
DQ13
DQ12
DQ6
DQ5
A19
A10
G7
C7
D7
E7
H7
K7
F7
J7
A8
A9
The package and/or data integrity may be compromised
if the package body is exposed to temperatures above
150°C for prolonged periods of time.
DQ15/A-1
DQ14
A11
DQ7
A12
A13
A14
C8
D8
G8
H8
E8
F8
K8
SA
J8
CIOf
A15
G9
A16
V
D9
E9
H9
NC
F9
NC
J9
SS
M10
F10
G10
A10
B10
L10
NC
NC
NC
NC
NC
NC
Pseudo
SRAM only
Shared
Flash only
7