m28333-3x Mindspeed Technologies, m28333-3x Datasheet - Page 65

• Manufacturer Part Number: m28333-3x
• Description: Single/dual/triple E3/ds3/sts-1 Line Interface Unit
• Manufacturer: Mindspeed Technologies

M28331/M28332/M28333 (–3x)
Single/Dual/Triple E3/DS3/STS-1 Line Interface Unit
28333-DSH-003-A
B.3 Solder Stencil Determination
Use the thickest possible solder mask, consistent with the components being
assembled to the PWB surface mount process. A standoff height of 2.0–4.2 mils
provides good solder joints for both the leads and the center pad. This is achieved
using a stencil thickness of 5, 6, or 7 mils.
B.4 Solder Reflow Profile
The ETQFP uses the standard TQFP reflow profile because the ETQFP package
construction does not add thermal mass. There is minimal additional thermal load
due to the increased solder area between the exposed die pad on the package and
the center pad on the PCB.
profiles for Sn63:Pb37 solder in the cases of natural convection and forced
convection ovens.
Mindspeed Technologies
Figures B-9
Appendix B: Exposed Thin Quad Flat (ETQFP) Pack
and
™
B-10
illustrate typical IR reflow
B.3 Solder Stencil Determination
B-9