m28333-3x Mindspeed Technologies, m28333-3x Datasheet - Page 57

• Manufacturer Part Number: m28333-3x
• Description: Single/dual/triple E3/ds3/sts-1 Line Interface Unit
• Manufacturer: Mindspeed Technologies

28333-DSH-003-A
Appendix B: Exposed Thin Quad Flat
(ETQFP) Pack
NOTE:
The Exposed Thin Quad Flat Pack (ETQFP) package provides greater design
flexibility and increased thermal efficiency, while using a standard size IC
package. The exposed pad improves performance by permitting higher clock
speeds, more compact systems, and a more aggressive design criteria. ETQFP
thermal performance is better than standard packages; however, to make
optimum use of the thermal efficiencies designed into the ETQFP, the PCB must
be designed with this package in mind. The following sections of this document
provide more information regarding the thermal performance and PCB design for
Mindspeed ETQFPs.
Mindspeed recommends that the exposed paddle on the M28333–3x be
soldered to the ground side of the PCB for reasons described below. Do
not route PCB traces or vias under the exposed paddle area of the
M28333–3x device.
Mindspeed Technologies
B
™
B-1