m28333-3x Mindspeed Technologies, m28333-3x Datasheet - Page 62

• Manufacturer Part Number: m28333-3x
• Description: Single/dual/triple E3/ds3/sts-1 Line Interface Unit
• Manufacturer: Mindspeed Technologies

Appendix B: Exposed Thin Quad Flat (ETQFP) Pack
B.2 Package Thermal Characterization
B.2.4 Thermal Test Structure
Figure B-5. Test Performance Structure (A = 100 mm, B = 100 mm, L
Table B-2. Specification for a Two-Layer Test Board
Table B-3. Specification for a Four-Layer Test Board
B-6
Substrate Material
Thickness
Stackup (signal layers, Cu planes)
Cu Coverage (signal layer—top/bottom)
Cu Coverage (power/ground layer)
Inner Cu Thickness (spec)
Substrate Material
Thickness
Stackup (signal layers, Cu planes)
Cu Coverage (signal layer—top/bottom)
Cu Coverage (power/ground layer)
Inner Cu Thickness (spec)
B.2.4.2 Thermal Test
Environment
B.2.4.1 Test
Boards
Package thermal performance has been tested following JEDEC standards. The
ETQFP package is mounted at the center of a 100 mm × 100 mm, six layer test
board and is tested under different air flow velocities.
system configuration.
Two different test boards have been used to evaluate package thermal
performance for both worst and best conditions.
these test boards.
Drawing Number TR03-T1
Drawing Number TR03-T2
Mindspeed Technologies
Air Flow
L
B
Single/Dual/Triple E3/DS3/STS-1 Line Interface Unit
A
P
= 1.40 mm, L
™
35 x 3.5
35 x 3.5
1.6 mm
1.6 mm
100%
1S0P
1S2P
100%
10%
10%
FR-4
FR-4
M28331/M28332/M28333 (–3x)
L
P
B
Table B-2
= 1.60 mm)
B
100998_027a
Figure B-5
lists specifications of
28333-DSH-003-A
illustrates the