m28333-3x Mindspeed Technologies, m28333-3x Datasheet - Page 64

• Manufacturer Part Number: m28333-3x
• Description: Single/dual/triple E3/ds3/sts-1 Line Interface Unit
• Manufacturer: Mindspeed Technologies

Appendix B: Exposed Thin Quad Flat (ETQFP) Pack
B.2 Package Thermal Characterization
Table B-5. Test Conditions
Figure B-7. Package Thermal Resistance as a Function of Airflow Velocity for an 64 ETQFP
Figure B-8. Package Thermal Resistance as a Function of Airflow Velocity for an 80 ETQFP
B-8
Package Type:
Body Size
Die Size
Die Pad Size
60
50
40
30
20
10
0
60
50
40
30
20
10
0
7 mm x 7 mm
3.81 mm x 3.81 mm
5 mm x 5 mm
0
0
50
50
48 EQTFP
100
100
Table B-5
150
150
Mindspeed Technologies
Air Flow Velocity (LFM)
Air Flow Velocity (LFM)
200
200
lists the test conditions for
10 mm x 10 mm
6.35 mm x 6.35 mm
7.50 mm x 7.50 mm
250
250
64 ETQFP
300
300
Two Layer PCB
Four Layer PCB
Six Layer PCB
Two Layer PCB
Four Layer PCB
Six Layer PCB
Single/Dual/Triple E3/DS3/STS-1 Line Interface Unit
350
350
400
400
™
Figures B-6
14 mm x 14 mm
7.8 mm x 7.8 mm
9.50 mm x 9.50 mm
450
450
M28331/M28332/M28333 (–3x)
500
500
80 ETQFP
through B-8.
100998_032
100998_033
28333-DSH-003-A