m28333-3x Mindspeed Technologies, m28333-3x Datasheet - Page 58

• Manufacturer Part Number: m28333-3x
• Description: Single/dual/triple E3/ds3/sts-1 Line Interface Unit
• Manufacturer: Mindspeed Technologies

Appendix B: Exposed Thin Quad Flat (ETQFP) Pack
B.1 Introduction
B-2
B.1 Introduction
The ETQFP is implemented using a standard epoxy-resin package mold
compound. The integrated circuit die is attached to the lead-frame die pad with a
thermally conductive epoxy. The leadframe is designed with a deep downset of
the die attach pad so it will be exposed on the bottom surface of the package after
mold. This provides an extremely low thermal resistance between the IC junction
and the exterior of the surface.
solder reflow techniques. This allows efficient attachment to the board, and
permits the board structure to be used as a heat sink for the IC. Using thermal
vias, the lead frame die pad can be attached to a ground plane or special heat sink
structure designed into the PCB.
package components.
Figure B-1. Schematic Representation of the Package Components
Lead Frame
The die pad’s external surface can be attached to the PCB using standard
Mindspeed Technologies
Mold Compound
Lead Frame
Single/Dual/Triple E3/DS3/STS-1 Line Interface Unit
Figure B-1
™
M28331/M28332/M28333 (–3x)
illustrates the schematic of the
Die
Die Attach
28333-DSH-003-A
100998_030