mc9s12hz256v2 Freescale Semiconductor, Inc, mc9s12hz256v2 Datasheet - Page 628

• Manufacturer Part Number: mc9s12hz256v2
• Description: Hcs12 Microcontrollers
• Manufacturer: Freescale Semiconductor, Inc

1
Appendix A Electrical Characteristics
A.1.8
Power dissipation and thermal characteristics are closely related. The user must assure that the maximum
operating junction temperature is not exceeded. The average chip-junction temperature (T
obtained from:
The total power dissipation can be calculated from:
628
T J
T J
T A
P D
P D
P INT
P INT
P IO
Num C
10
The values for thermal resistance are achieved by package simulations
JA
1
2
3
4
5
6
7
8
9
P
=
=
=
=
=
IO
=
=
T Thermal Resistance LQFP112, single sided PCB
T Thermal Resistance LQFP112, double sided PCB
T Junction to Board LQFP112
T Junction to Case LQFP112
T Junction to Package Top LQFP112
T Thermal Resistance QFP 80, single sided PCB
T Thermal Resistance QFP 80, double sided PCB
T Junction to Board QFP80
T Junction to Case QFP80
T Junction to Package Top QFP80
T A
Junction Temperature, [ C
Ambient Temperature, [ C
=
=
Total Chip Power Dissipation, [W]
P INT
is the sum of all output currents on I/O ports associated with VDDX1,2 and VDDM1,2,3.
Package Thermal Resistance, [ C/W]
with 2 internal planes
i
Chip Internal Power Dissipation, [W]
I DDR V DDR
+
with 2 internal planes
Power Dissipation and Thermal Characteristics
R DSON
P D
+
P IO
JA
I IO
+
3
i
Rating
2
I DDA V DDA
Table A-5. Thermal Package Characteristics
MC9S12HZ256 Data Sheet, Rev. 2.05
2
Symbol
JA
JA
JB
JC
JA
JA
JB
JC
JT
JT
Min
—
—
—
—
—
—
—
—
–
–
1
Typ
—
—
—
—
—
—
—
—
–
–
Freescale Semiconductor
J
Max
) in C can be
54
41
31
11
51
41
27
14
2
3
o
o
o
o
o
o
o
o
o
o
Unit
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W