w83627sf Winbond Electronics Corp America, w83627sf Datasheet - Page 147

• Manufacturer Part Number: w83627sf
• Description: Winbond I/o
• Manufacturer: Winbond Electronics Corp America

18. PACKAGE DIMENSIONS
(128-pin QFP)
3 8
1
1 2 8
3 9
Seating Plane
Note: All data and specifications are subject to change without notice.
Headquarters
No. 4, Creation Rd. III
Science-Based Industrial Park
Hsinchu, Taiwan
TEL: [phone]
FAX: [phone]
www: http://www.winbond.com.tw/
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.
Taipei, Taiwan
TEL: [phone]
FAX: [phone]
TLX: 16485 WINTPE
e
See Detail F
H
E
E
b
y
1 0 3
6 4
1 0 2
6 5
A
A
2
1
D
A
H
D
Winbond Electronics (H.K.) Ltd.
Rm. 803, World Trade Square, Tower II
123 Hoi Bun Rd., Kwun Tong
Kowloon, Hong Kong
TEL: [phone]
FAX: [phone]
c
L
L
1
- 140 -
Detail F
Note:
Publication Release Date: Nov. 2000
Symbol
1.Dimension D & E do not include interlead
2.Dimension b does not include dambar
3.Controlling dimension : Millimeter
4.General appearance spec. should be based
protrusion/intrusion
flash.
on final visual inspection spec.
A
A
b
c
D
E
e
H
H
L
L
y
0
1
2
D
E
1
13.90
19.90
Min
0.25
0.10
0.10
17.00
23.00
2.57
0.65
0
Dimension in inch
Winbond Electronics
(North America) Corp.
2730 Orchard Parkway
San Jose, CA 95134 U.S.A.
TEL: [phone]
FAX: [phone]
14.00
Nom Max
0.35
0.20
0.15
20.00
17.20
2.72
23.20
0.50
0.80
1.60
.
14.10
20.10
17.40
23.40
0.45
2.87
0.30
0.20
0.95
0.08
7
PRELIMINARY
W83627SF
0.010
0.101
0.547
Min
0.004
0.004
0.783
0.669
0.905
0.025
0
Dimension in mm
Nom
0.551
0.787
0.913
0.014
0.107
0.008
0.006
0.677
0.031
0.063
0.020
Revision 0.60
Max
0.555
0.685
0.037
0.012
0.008
0.791
0.921
0.003
0.018
0.113
7