mc33905s Freescale Semiconductor, Inc, mc33905s Datasheet - Page 13

• Manufacturer Part Number: mc33905s
• Description: System Basis Chip Gen2 With High Speed Can And Lin Interface
• Manufacturer: Freescale Semiconductor, Inc

Table 3. Maximum Ratings (continued)
permanent damage to the device.
Analog Integrated Circuit Device Data
Freescale Semiconductor
THERMAL RATINGS
THERMAL RESISTANCE
Notes
ESD Capability
Junction temperature
Ambient temperature
Storage temperature
Thermal resistance junction to ambient
Peak Package Reflow Temperature During Reflow
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
1.
2.
3.
4.
* AECQ100
* According to IEC 61000-4-2 (C
0_20081210.pdf”
* According to “OEM_HW_Requirements_For_CAN_LIN_FR-Interfaces_V1
CANH, CANL without bus filter
LIN with and without bus filter
I/O with external components (22k - 10nF)
ESD testing is performed in accordance with the Human Body Model (HBM) (C
Model (CDM), Robotic (C
The voltage on non-Vsup pins should never exceed the Vsup voltage at any time or permanent damage to the device may occur.Pin
soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
This parameter was measured according to
Charge Device Model - JESD22/C101 (C
device unpowered, CANH and CANL pin without capacitor, versus GND
device unpowered, LIN pin, versus GND
device unpowered, VS1/VS2 (100 nF to GND), versus GND
Human Body Model - JESD22/A114 (C
all other Pins including CANH and CANL
Corner Pins (Pins 1, 16, 17, and 32)
CANH and CANL. LIN1 and LIN2, Pins versus all GND pins
All other Pins (Pins 2-15, 18-31)
(1)
Figure 8. PCB with Top and Bottom Layer Dissipation Area (Dual Layer)
ZAP
PCB 100mm x 100mm
Ratings
ZAP
= 4.0 pF).
= 150 pF, R
ZAP
ZAP
(2),
Figure 8
= 100 pF, R
ZAP
= 4.0 pF)
(3)
= 330 Ω)
below:
ZAP
= 1500 Ω)
Top side, 300 sq. mm
(20mmx15mm)
Bottom side
20mm x 40mm
V
V
V
V
V
V
V
V
V
V
Symbol
ZAP
T
ESD1-1
ESD1-2
ESD2-1
ESD2-2
ESD3-1
ESD3-2
ESD3-3
ESD4-1
ESD4-2
ESD4-3
R
T
PPRT
T
T
θJA
ST
A
= 100 pF, R
J
Bottom view
ZAP
ELECTRICAL CHARACTERISTICS
= 1500 Ω) and the Charge Device
-40 to 125
-55 to 165
±15000
±15000
±15000
±12000
±8000
±2000
±9000
±7000
Value
Note 3
±750
±500
50
150
(4)
MAXIMUM RATINGS
°C/W
Unit
°C
°C
°C
°C
V
33904/5
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