mt46h8m16lfcf-75-it Micron Semiconductor Products, mt46h8m16lfcf-75-it Datasheet - Page 13

• Manufacturer Part Number: mt46h8m16lfcf-75-it
• Description: 128mb Mobile Ddr Sdram Mt46h4m32lfb5-6
• Manufacturer: Micron Semiconductor Products

Figure 7:
PDF: 09005aef8331b3e9 / Source: 09005aef8331b3ce
128mb_mobile_ddr_sdram_t35m__2.fm - Rev. B 06/08 EN
SEATING PLANE
DIMENSIONS APPLY
TO SOLDER BALLS POST
REFLOW. THE PRE-
REFLOW DIAMETER IS
0.42 ON A 0.40 SMD
BALL PAD
11.20 ±0.10
90X Ø0.45
0.10 A
BALL A9
5.60 ±0.05
90-Ball VFBGA Package
Notes:
A
0.65 ±0.05
1. All dimensions are in millimeters.
3.20
8.00 ±0.10
6.40
C L
4.00 ±0.05
C L
6.50 ±0.05
0.80 TYP
BALL A1 ID
BALL A1
13
13.00 ±0.10
Micron Technology, Inc., reserves the right to change products or specifications without notice.
128Mb: x16, x32 Mobile DDR SDRAM
1.00 MAX
SOLDER BALL MATERIAL:
SUBSTRATE MATERIAL:
MOLD COMPOUND:
SAC105 (98.5% Sn, 1%Ag, 0.5% Cu)
PLASTIC LAMINATE
EPOXY NOVOLAC
Package Dimensions
©2007 Micron Technology, Inc. All rights reserved.
BALL A1 ID
Preliminary