spakdsp301vl100 Freescale Semiconductor, Inc, spakdsp301vl100 Datasheet - Page 79

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spakdsp301vl100

Manufacturer Part Number
spakdsp301vl100
Description
Dsp56301 24-bit Digital Signal Processor
Manufacturer
Freescale Semiconductor, Inc
Datasheet
Packaging
This section provides information on the available packages for the DSP56301, including diagrams of the package
pinouts and tables showing how the signals discussed in Section 1 are allocated for each package. The DSP56301
is available in two package types:
Note: Both packages are available in lead-bearing and lead-free versions. Switching a design from a lead-bearing
Freescale Semiconductor
208-pin Thin Quad Flat Pack (TQFP)
252-pin Molded Array Process-Ball Grid Array (MAP-BGA)
package device to a lead-free package device may require a change in the board manufacturing process.
The lead-free package requires a higher solder flow temperature than the lead-bearing device. Refer to
Lead-Free BGA Solder Joint Assembly Evaluation (EB635) for manufacturing considerations when
incorporating lead-free package devices into a design.
DSP56301 Technical Data, Rev. 10
3
3-1

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