spakdsp301vl100 Freescale Semiconductor, Inc, spakdsp301vl100 Datasheet - Page 101

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spakdsp301vl100

Manufacturer Part Number
spakdsp301vl100
Description
Dsp56301 24-bit Digital Signal Processor
Manufacturer
Freescale Semiconductor, Inc
Datasheet
3.4 MAP-BGA Package Mechanical Drawing
Freescale Semiconductor
Figure 3-6.
DSP56301 Mechanical Information, 252-pin MAP-BGA Package
DSP56301 Technical Data, Rev. 10
Notes:
1. Dimensions are in millimeters.
2. Interpret dimensions and
3. Dimension b is measured at the
4. Datum Z (seating plane) is
5. Parallelism measurement shall
tolerances per ASME Y14.5M,
1994.
maximum solder ball diameter,
parallel to datum plane Z.
defined by the spherical crowns
of the solder balls.
exclude any effect of mark on
top surface of package.
MAP-BGA Package Mechanical Drawing
DIM MIN
A1 0.50
A2
A
b
D
E
e
Millimeters
0.60
21.00 BSC
21.00 BSC
1.6
1.27 BSC
1.16 REF
MAX
0.70
0.90
1.9
3-23

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