HM-6504 Intersil Corporation, HM-6504 Datasheet - Page 10

• Manufacturer Part Number: HM-6504
• Description: 4096 x 1 CMOS RAM
• Manufacturer: Intersil Corporation

Die Characteristics
DIE DIMENSIONS:
METALLIZATION:
GLASSIVATION:
Metallization Mask Layout
NOTE:
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
1. Pin numbers correspond to DIP Package only.
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
136 x 169 x 19 1mils
Type: Si - Al
Thickness: 11k
Type: SiO
Thickness: 8k
2
Å
Å
1k
2k
Å
Å
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
A2
A3
A4
A5
Q
A1
HM-6504/883
A0
W
HM-6504/883
GND
6-143
WORST CASE CURRENT DENSITY:
LEAD TEMPERATURE (10s soldering):
E
1.79 x 10
300
D
VCC
o
C
5
A/cm
A6
2
A7
A8
A9
A10
A11