MCC501RX166TD0B Motorola / Freescale Semiconductor, MCC501RX166TD0B Datasheet - Page 89

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MCC501RX166TD0B

Manufacturer Part Number
MCC501RX166TD0B
Description
Network Processor, 16 Processing Elements, 166MHz Core Operating Frequency, 5Gbps Max Throughput, 838-CBGA
Manufacturer
Motorola / Freescale Semiconductor
Datasheet
Chapter 4
Mechanical Specifications
Package Views
The C-5 network processor is an 838 pin (29 pins x 29 pins) Ball Grid Array (BGA) package
as shown in the following illustrations.
Table 55
defines the package measurements.
Figure 26 C-5 Network Processor BGA Package Side View
A
4
A
2
A
3
A
A
Seating Plane
1
HiTCE: Green ceramic is thermally matched to FR4 circuit board.
The aluminum lid is electrically connected to the grounded substrate of the C-5 NP.
Neither the lid nor any heat sink connected to the lid should be part of a current-carrying
path. It is acceptable, however, to connect the lid or heatsink to ground if necessary
(through the standoff screws for the heat sink).

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