MCC501RX166TD0B Motorola / Freescale Semiconductor, MCC501RX166TD0B Datasheet - Page 68

• Manufacturer Part Number: MCC501RX166TD0B
• Description: Network Processor, 16 Processing Elements, 166MHz Core Operating Frequency, 5Gbps Max Throughput, 838-CBGA
• Manufacturer: Motorola / Freescale Semiconductor

68
January 21, 2002 — Preliminary Version
C
HAPTER
3: E
LECTRICAL
S
PECIFICATIONS
2 Thermal performance specifications based on following conditions:
3 Effective Thermal Resistance (
Figure 10 Thermal Performance for C-5 Network Processor Heat Sink (see
•
•
performance of the heat sink and board, as outlined in Note 2 above.
Theoretical calculation of thermal resistance as a function of airflow velocity across heat sink
Printed circuit board is based on the C-Ware Development System’s C-5 NP Switch
Module reference design, with specifications of:
– 14 total layers (5 planes). Planes at least 100mm x 100mm below the C-5 NP
– FR4 board material, Cu signal and plane material.
– 0.5mils signal layer thickness, 1.4mils plane layer thickness.
– Thermal resistance, board to ambient (
Custom heat sink design has the following characteristics:
– Dimensions: 100mm x 80mm x 10mm (height)
– Thermal resistance heat sink to ambient (
– Thermal resistance case to heat sink (
– Note that target heat sink design is for low profile (10mm height) applications.
3
2
1
0
before any interruptions.
provides the characteristic thermal resistance curve for this head sink for
various airflow rates.
material).
Significantly better thermal performance is possible with taller and/or wider
designs. Contact your C-Port representative for heat sink options.
0
200
400
Velocity (ft/min)
effective
600
=
JA JB
800
CS
/ (
) of 0.03
BA
) of 1.2
SA
JA
1000
) of 1.6
+
o
JB
C/W (Chomerics T705 thermal
o
)) reflects the total thermal
C/W.
o
C/W @200 LFM.
step 2
above)
C-Port Confidential
Figure 10