LPC1850FET256 NXP Semiconductors, LPC1850FET256 Datasheet - Page 91

• Manufacturer Part Number: LPC1850FET256
• Description: The LPC1850FET256 is a high-performance, cost-effective Cortex-M3 microcontroller featuring 200 kB of SRAM, and advanced peripherals including Ethernet, High Speed USB 2
• Manufacturer: NXP Semiconductors

NXP Semiconductors
9. Thermal characteristics
Table 7.
V
LPC1850_30_20_10
Preliminary data sheet
Symbol
T
DD
j(max)
= 2.2 V to 3.6 V; T
Thermal characteristics
Parameter
maximum junction
temperature
amb
The average chip junction temperature, T
equation:
The internal power dissipation is the product of I
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
T
=
•
•
•
j

=
T
R
P
40
amb
D
T
th(j-a)
amb

= sum of internal and I/O power dissipation
C to +85
= ambient temperature (C),
+
= the package junction-to-ambient thermal resistance (C/W)

P
D
All information provided in this document is subject to legal disclaimers.

Conditions

C unless otherwise specified;
R
th j a
Rev. 3.1 — 15 December 2011

–


j
(C), can be calculated using the following
Min
-
DD
32-bit ARM Cortex-M3 microcontroller
and V
LPC1850/30/20/10
DD
Typ
-
. The I/O power dissipation of
Max
125
© NXP B.V. 2011. All rights reserved.
Unit
91 of 157
C
(1)