LPC1850FET256 NXP Semiconductors, LPC1850FET256 Datasheet - Page 4

• Manufacturer Part Number: LPC1850FET256
• Description: The LPC1850FET256 is a high-performance, cost-effective Cortex-M3 microcontroller featuring 200 kB of SRAM, and advanced peripherals including Ethernet, High Speed USB 2
• Manufacturer: NXP Semiconductors

NXP Semiconductors
4. Ordering information
Table 1.
Table 2.
LPC1850_30_20_10
Preliminary data sheet
Type number
LPC1850FET256
LPC1850FET180
LPC1850FBD208 LQFP208
LPC1830FET256
LPC1830FET180
LPC1830FET100
LPC1830FBD144 LQFP144
LPC1820FET100
LPC1820FBD144 LQFP144
Type number
LPC1850FET256 200 kB
LPC1850FET180 200 kB
LPC1850FBD208 200 kB
LPC1830FET256 200 kB
LPC1830FET180 200 kB
LPC1830FET100 200 kB
LPC1830FBD144 200 kB
LPC1820FET100 168 kB
LPC1820FBD144 168 kB
LPC1820FBD100 168 kB
LPC1810FET100 136 kB
LPC1810FBD144 136 kB
LPC1820FBD100 LQFP100
LPC1810FET100
LPC1810FBD144 LQFP144
Ordering information
Ordering options
4.1 Ordering options
Total
SRAM
Package
Name
LBGA256
TFBGA180 Thin fine-pitch ball grid array package; 180 balls
LBGA256
TFBGA180 Thin fine-pitch ball grid array package; 180 balls
TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1
TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1
TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1
LCD Ethernet USB0
yes
yes
yes
no
no
no
no
no
no
no
no
no
Description
Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm
Plastic low profile quad flat package; 208 leads; body 28  28  1.4 mm
Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm
Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm
Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm
Plastic low profile quad flat package; 100 leads; body 14  14  1.4 mm
Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm
yes
yes
yes
yes
yes
yes
yes
no
no
no
no
no
All information provided in this document is subject to legal disclaimers.
(Host,
Device,
OTG)
yes
yes
yes
yes
yes
yes
yes
yes
yes
yes
no
no
Rev. 3.1 — 15 December 2011
USB1
(Host,
Device)/
ULPI
interface
yes/yes
yes/yes
yes/yes
yes/yes
yes/yes
yes/no
yes/no
no
no
no
no
no
ADC
channels
8
8
8
8
8
4
8
4
8
5
4
8
32-bit ARM Cortex-M3 microcontroller
yes
yes
yes
yes
PWM
yes
yes
yes
no
no
no
no
yes
LPC1850/30/20/10
QEI
yes
yes
yes
yes
yes
no
no
no
no
no
no
no
GPIO
164
118
142
164
118
49
83
49
83
49
49
83
© NXP B.V. 2011. All rights reserved.
Package
LBGA256
TFBGA180
LQFP208
LBGA256
TFBGA180
TFBGA100
LQFP144
TFBGA100
LQFP144
LQFP100
TFBGA100
LQFP144
Version
SOT740-2
SOT570-3
SOT459-1
SOT740-2
SOT570-3
SOT486-1
SOT486-1
SOT407-1
SOT486-1
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