SAM9X35 Atmel Corporation, SAM9X35 Datasheet - Page 442
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SAM9X35
Manufacturer Part Number
SAM9X35
Description
Manufacturer
Atmel Corporation
Datasheets
1.SAM9261.pdf
(248 pages)
2.SAM9X25.pdf
(45 pages)
3.SAM9X25.pdf
(1145 pages)
4.SAM9X25.pdf
(45 pages)
5.SAM9X25.pdf
(1325 pages)
Specifications of SAM9X35
Flash (kbytes)
0 Kbytes
Pin Count
217
Max. Operating Frequency
400 MHz
Cpu
ARM926
Hardware Qtouch Acquisition
No
Max I/o Pins
105
Ext Interrupts
105
Usb Transceiver
3
Usb Speed
Hi-Speed
Usb Interface
Host, Device
Spi
2
Twi (i2c)
3
Uart
7
Can
2
Lin
4
Ssc
1
Ethernet
1
Sd / Emmc
2
Graphic Lcd
Yes
Video Decoder
No
Camera Interface
No
Adc Channels
12
Adc Resolution (bits)
10
Adc Speed (ksps)
440
Resistive Touch Screen
Yes
Temp. Sensor
No
Crypto Engine
No
Sram (kbytes)
32
Self Program Memory
NO
External Bus Interface
1
Dram Memory
DDR/LPDDR, SDRAM/LPSDR
Nand Interface
Yes
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
1.8/3.3
Operating Voltage (vcc)
0.9 to 1.1
Fpu
No
Mpu / Mmu
No/Yes
Timers
6
Output Compare Channels
6
Input Capture Channels
6
Pwm Channels
4
32khz Rtc
Yes
Calibrated Rc Oscillator
No
- SAM9261 PDF datasheet
- SAM9X25 PDF datasheet #2
- SAM9X25 PDF datasheet #3
- SAM9X25 PDF datasheet #4
- SAM9X25 PDF datasheet #5
- Current page: 442 of 1145
- Download datasheet (26Mb)
Figure 30-21. Automatic Update During AUTO-REFRESH Command and SDRAM Access
30.5.4.2
442
442
COMMAND
SDCLK
BA[1:0]
A[12:0]
SAM9X25
SAM9X25
CKE
Power-down Mode
NOP
PRCHALL
0
This mode is activated by setting the low-power command bits [LPCB] to ‘10’.
Power-down mode is used when no access to the SDRAM device is possible. In this mode,
power consumption is greater than in self refresh mode. This state is similar to normal mode (No
low-power mode/No self refresh mode), but the CKE pin is low and the input and output buffers
are deactivated as soon the SDRAM device is no longer accessible. In contrast to self refresh
mode, the SDRAM device cannot remain in low-power mode longer than the refresh period (64
ms). As no auto-refresh operations are performed in this mode, the DDRSDRC carries out the
refresh operation. In order to exit low-power mode, a NOP command is required in the case of
Low-power SDR-SDRAM and SDR-SDRAM devices. In the case of Low-power DDR1-SDRAM
devices, the controller generates a NOP command during a delay of at least TXP. In addition,
Low-power DDR1-SDRAM and DDR2-SDRAM must remain in power-down mode for a mini-
mum period of TCKE periods.
The exit procedure is faster than in self refresh mode. See
DDRSDRC returns to power-down mode as soon as the SDRAM device is not selected. It is
possible to define when power-down mode is enabled by setting the register LPR, timeout com-
mand bit.
• 00 = Power-down mode is enabled as soon as the SDRAM device is not selected
• 01 = Power-down mode is enabled 64 clock cycles after completion of the last access
• 10 = Power-down mode is enabled 128 clock cycles after completion of the last access
Trp
NOP
ARFSH
2
Trfc
NOP
Pasr-Tcr-Ds
MRS
Update Extended mode
register
Tmrd
NOP
Figure 30-22 on page
ACT
0
11054A–ATARM–27-Jul-11
11054A–ATARM–27-Jul-11
443. The
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