SAM9G15 Atmel Corporation, SAM9G15 Datasheet - Page 1194
![no-image](/images/manufacturer_photos/0/0/79/atmel_corporation_sml.jpg)
SAM9G15
Manufacturer Part Number
SAM9G15
Description
Manufacturer
Atmel Corporation
Datasheets
1.SAM9261.pdf
(248 pages)
2.SAM9261.pdf
(1274 pages)
3.SAM9261.pdf
(43 pages)
4.SAM9G15.pdf
(1211 pages)
5.SAM9G15.pdf
(45 pages)
Specifications of SAM9G15
Flash (kbytes)
0 Kbytes
Pin Count
217
Max. Operating Frequency
400 MHz
Cpu
ARM926
Hardware Qtouch Acquisition
No
Max I/o Pins
105
Ext Interrupts
105
Usb Transceiver
3
Usb Speed
Hi-Speed
Usb Interface
Host, Device
Spi
2
Twi (i2c)
3
Uart
6
Lin
4
Ssc
1
Sd / Emmc
2
Graphic Lcd
Yes
Video Decoder
No
Camera Interface
No
Adc Channels
12
Adc Resolution (bits)
10
Adc Speed (ksps)
440
Resistive Touch Screen
Yes
Temp. Sensor
No
Crypto Engine
No
Sram (kbytes)
32
Self Program Memory
NO
External Bus Interface
1
Dram Memory
DDR2/LPDDR, SDRAM/LPSDR
Nand Interface
Yes
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
1.8/3.3
Operating Voltage (vcc)
0.9 to 1.1
Fpu
No
Mpu / Mmu
No/Yes
Timers
6
Output Compare Channels
6
Input Capture Channels
6
Pwm Channels
4
32khz Rtc
Yes
Calibrated Rc Oscillator
No
- SAM9261 PDF datasheet
- SAM9261 PDF datasheet #2
- SAM9261 PDF datasheet #3
- SAM9G15 PDF datasheet #4
- SAM9G15 PDF datasheet #5
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- Download datasheet (25Mb)
Table 46-1.
Table 46-2.
Table 46-3.
Table 46-4.
46.2
1194
450
Moisture Sensitivity Level
JEDEC Drawing Reference
JESD97 Classification
Ball Land
Solder Mask Opening
Marking
SAM9G15
Device and 217-ball BGA Package Maximum Weight
217-ball BGA Package Characteristics
Package Reference
Soldering Information
All devices are marked with the Atmel logo and the ordering code.
Additional marking may be in one of the following formats:
where
• “YY”: manufactory year
• “WW”: manufactory week
• “V”: revision
• “XXXXXXXXX”: lot number
YYWW
XXXXXXXXX
mg
0.43 mm ± 0.05
0.30 mm ± 0.05
3
MO-205
e1
V
ARM
11052C–ATARM–21-Nov-11
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