PIC18F4550-I/P Microchip Technology Inc., PIC18F4550-I/P Datasheet - Page 363
![no-image](/images/manufacturer_photos/0/4/440/microchip_technology_inc__sml.jpg)
PIC18F4550-I/P
Manufacturer Part Number
PIC18F4550-I/P
Description
40 PIN, 32 KB FLASH, 2048 RAM, FS-USB 2.0
Manufacturer
Microchip Technology Inc.
Datasheet
1.PIC18F4550-IP.pdf
(430 pages)
Specifications of PIC18F4550-I/P
A/d Inputs
13-Channel, 10-Bit
Comparators
2
Cpu Speed
12 MIPS
Eeprom Memory
256 Bytes
Input Output
34
Interface
I2C/SPI/UART/USART/USB
Memory Type
Flash
Number Of Bits
8
Package Type
40-pin PDIP
Programmable Memory
32K Bytes
Ram Size
2K Bytes
Speed
48 MHz
Timers
1-8-bit, 3-16-bit
Voltage, Range
2-5.5 V
Lead Free Status / Rohs Status
RoHS Compliant part
Electrostatic Device
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28.0
Absolute Maximum Ratings
Ambient temperature under bias.............................................................................................................. .-40°C to +85°C
Storage temperature .............................................................................................................................. -65°C to +150°C
Voltage on any pin with respect to V
Voltage on V
Voltage on MCLR with respect to V
Total power dissipation (Note 1) ...............................................................................................................................1.0W
Maximum current out of V
Maximum current into V
Input clamp current, I
Output clamp current, I
Maximum output current sunk by any I/O pin..........................................................................................................25 mA
Maximum output current sourced by any I/O pin ....................................................................................................25 mA
Maximum current sunk by all ports .......................................................................................................................200 mA
Maximum current sourced by all ports ..................................................................................................................200 mA
© 2006 Microchip Technology Inc.
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
Note 1: Power dissipation is calculated as follows:
2: Voltage spikes below V
ELECTRICAL CHARACTERISTICS
Pdis = V
latch-up. Thus, a series resistor of 50-100
RE3 pin, rather than pulling this pin directly to V
DD
with respect to V
DD
IK
OK
(V
x {I
DD
I
SS
(V
DD
< 0 or V
pin ..............................................................................................................................250 mA
O
pin ...........................................................................................................................300 mA
– ∑ I
< 0 or V
SS
OH
I
SS
SS
SS
> V
......................................................................................................... -0.3V to +7.5V
(†)
} + ∑ {(V
(Note 2) ......................................................................................... 0V to +13.25V
O
at the MCLR/V
(except V
DD
> V
)
DD
PIC18F2455/2550/4455/4550
DD
)
DD
– V
Preliminary
, MCLR and RA4) .......................................... -0.3V to (V
OH
PP
) x I
should be used when applying a “low” level to the MCLR/V
/RE3 pin, inducing currents greater than 80 mA, may cause
OH
SS
} + ∑(V
.
OL
x I
OL
)
DS39632C-page 361
DD
+ 0.3V)
20 mA
20 mA
PP
/
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