EPM1270F256C3 Altera, EPM1270F256C3 Datasheet - Page 49
![IC MAX II CPLD 1270 LE 256-FBGA](/photos/6/70/67063/544-256-fbga_sml.jpg)
EPM1270F256C3
Manufacturer Part Number
EPM1270F256C3
Description
IC MAX II CPLD 1270 LE 256-FBGA
Manufacturer
Altera
Series
MAX® IIr
Specifications of EPM1270F256C3
Programmable Type
In System Programmable
Delay Time Tpd(1) Max
6.2ns
Voltage Supply - Internal
2.5V, 3.3V
Number Of Logic Elements/blocks
1270
Number Of Macrocells
980
Number Of I /o
212
Operating Temperature
0°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
256-FBGA
Voltage
2.5V, 3.3V
Memory Type
FLASH
Number Of Logic Elements/cells
1270
Family Name
MAX II
# Macrocells
980
Frequency (max)
3.01205GHz
Propagation Delay Time
6.2ns
Number Of Logic Blocks/elements
127
# I/os (max)
212
Operating Supply Voltage (typ)
2.5/3.3V
In System Programmable
Yes
Operating Supply Voltage (min)
2.375V
Operating Supply Voltage (max)
3.6V
Operating Temp Range
0C to 85C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
256
Package Type
FBGA
For Use With
544-2380 - KIT DEV MAXII W/EPM 1270N
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
Lead Free Status / Rohs Status
Not Compliant
Other names
544-1321
EPM1270F256C3
EPM1270F256C3
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
EPM1270F256C3N
Manufacturer:
ALTERA
Quantity:
162
Part Number:
EPM1270F256C3N
Manufacturer:
ALTERA/阿尔特拉
Quantity:
20 000
Chapter 3: JTAG and In-System Programmability
Referenced Documents
Real-Time ISP
Design Security
Programming with External Hardware
Referenced Documents
© October 2008 Altera Corporation
For systems that require more than DC logic level control of I/O pins, the real-time
ISP feature allows you to update the CFM block with a new design image while the
current design continues to operate in the SRAM logic array and I/O pins. A new
programming file is updated into the MAX II device without halting the original
design’s operation, saving down-time costs for remote or field upgrades. The updated
CFM block configures the new design into the SRAM upon the next power cycle. It is
also possible to execute an immediate configuration of the SRAM without a power
cycle by using a specific sequence of ISP commands. The configuration of SRAM
without a power cycle takes a specific amount of time (t
I/O pins are tri-stated and weakly pulled-up to V
All MAX II devices contain a programmable security bit that controls access to the
data programmed into the CFM block. When this bit is programmed, design
programming information, stored in the CFM block, cannot be copied or retrieved.
This feature provides a high level of design security because programmed data within
flash memory cells is invisible. The security bit that controls this function, as well as
all other programmed data, is reset only when the device is erased. The SRAM is also
invisible and cannot be accessed regardless of the security bit setting. The UFM block
data is not protected by the security bit and is accessible through JTAG or logic array
connections.
MAX II devices can be programmed by downloading the information via in-circuit
testers, embedded processors, the Altera
ByteBlaster™ II, and USB-Blaster cables.
BP Microsystems, System General, and other programming hardware manufacturers
provide programming support for Altera devices. Check their websites for device
support information.
This chapter references the following documents:
■
■
■
■
DC and Switching Characteristics
IEEE 1149.1 (JTAG) Boundary-Scan Testing for MAX II Devices
Device Handbook
Real-Time ISP and ISP Clamp for MAX II Devices
Handbook
Using Jam STAPL for ISP via an Embedded Processor
Handbook
chapter in the MAX II Device Handbook
®
ByteblasterMV™, MasterBlaster™,
CCIO
chapter in the MAX II Device
.
chapter in the MAX II Device
CONFIG
). During this time, the
chapter in the MAX II
MAX II Device Handbook
3–7