MT45W256KW16BEGB-708 WT Micron Technology Inc, MT45W256KW16BEGB-708 WT Datasheet - Page 57

• Manufacturer Part Number: MT45W256KW16BEGB-708 WT
• Manufacturer: Micron Technology Inc

Specifications of MT45W256KW16BEGB-708 WT

• Operating Temperature (max): 85C
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / Rohs Status: Compliant

Package Dimensions
Figure 49:
This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein. Although
PDF: 09005aef8329f3e3 / Source: 09005aef82e419a5
8mb_4mb_burst_cr1_0_p22z__2.fm - Rev. B 4/ 08 EN
considered final, these specifications are subject to change, as further product development and data characterization sometimes occur.
Seating plane
CellularRAM is a trademark of Micron Technology, Inc., inside the U.S. and a trademark of Qimonda AG outside the U.S.
Dimensions apply
to solder balls
post-reflow.
Pre-reflow ball
diameter is 0.35
on a 0.30 SMD
ball pad.
6.00
54-Ball VFBGA
0.10 A
54X Ø0.37
Ball A6
3.00
Notes:
A
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc.
[e-mail] www.micron.com Customer Comment Line: 800-932-4992
1. All dimensions are in millimeters; MAX/MIN or typical (TYP) where noted.
2. Package width and length do not include mold protrusion; allowable mold protrusion is
3. The MT45W256KW16BEGB uses “green” packaging.
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
0.25mm per side.
All other trademarks are the property of their respective owners.
1.875
6.00 ±0.10
0.75
TYP
3.75
4Mb: 256K x 16 Async/Page/Burst CellularRAM 1.0 Memory
3.00 ±0.05
0.75 TYP
Ball A1
Ball A1 ID
57
0.70 ±0.05
4.00 ±0.05
®
8.00 ±0.10
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.00 MAX
Solder ball material:
Substrate material: plastic laminate
Mold compound: epoxy novolac
96.5% Sn, 3% Ag, 0.5% Cu
Package Dimensions
©2007 Micron Technology, Inc. All rights reserved.
Ball A1 ID