MPC8315E-RDBA Freescale, MPC8315E-RDBA Datasheet - Page 80

• Manufacturer Part Number: MPC8315E-RDBA
• Manufacturer: Freescale

Specifications of MPC8315E-RDBA

• Lead Free Status / RoHS Status: Compliant

Package and Pin Listings
Figure 60
23 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8315E is available in
a thermally enhanced plastic ball grid array (TEPBGA II), see
MPC8315E TEPBGA II,”
on the TEPBGA II.
23.1
The package parameters are as provided in the following list. The package type is 29 mm × 29 mm,
TEPBGA II.
80
Package outline
Interconnects
Pitch
Module height (typical)
Solder balls
Ball diameter (typical)
Package Parameters for the MPC8315E TEPBGA II
TDMxTFS (output)
shows the TDM transmit signal timing.
TDMxTFS (input)
TDMxRCK
TDMxTCK
TDMxTD
MPC8315E PowerQUICC
t
DMIVKH
and
Section 23.2, “Mechanical Dimensions of the TEPBGA II,”
Figure 60. TDM Transmit Signals
t
DM_OUTAC
t
DMTKHOV
™
II Pro Processor Hardware Specifications, Rev. 0
t
DM_HIGH
t
DMFSIXKH
29 mm × 29 mm
620
1 mm
2.23 mm
96.5 Sn/3.5 Ag (VR package)
0.6 mm
t
DMFSKHOV
t
DM
t
DM_LOW
Section 23.1, “Package Parameters for the
t
DM_OUTHI
t
DMTKHOX
Freescale Semiconductor
t
DMFSKHOX
for information