LPC1764FBD100 NXP Semiconductors, LPC1764FBD100 Datasheet - Page 38

• Manufacturer Part Number: LPC1764FBD100
• Description: IC, 32BIT MCU ARM CORTEX 100MHZ LQFP-100
• Manufacturer: NXP Semiconductors

Specifications of LPC1764FBD100

• Controller Family/series: (ARM Cortex)
• No. Of I/o's: 70
• Ram Memory Size: 32KB
• Cpu Speed: 100MHz
• No. Of Timers: 4
• Interface: CAN, I2C, SPI, UART
• Core Size: 32 Bit
• Program Memory Size: 128KB
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

NXP Semiconductors
Table 4.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
[3]
[4]
[5]
[6]
9. Thermal characteristics
LPC1768_66_65_64_2
Objective data sheet
Symbol
I
I
I
T
P
V
DD
SS
latch
stg
tot(pack)
esd
The following applies to the limiting values:
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to V
Including voltage on outputs in 3-state mode.
Not to exceed 4.6 V.
The peak current is limited to 25 times the corresponding maximum current.
Dependent on package type.
Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor.
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum.
otherwise noted.
Limiting values
Parameter
supply current
ground current
I/O latch-up current
storage temperature
total power dissipation (per package)
electrostatic discharge voltage
9.1 Thermal characteristics
T
The average chip junction temperature, T
equation:
The internal power dissipation is the product of I
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
•
•
•
j
=
…continued
T
R
P
amb
D
T
th(j-a)
amb
= sum of internal and I/O power dissipation
= ambient temperature ( C),
= the package junction-to-ambient thermal resistance ( C/W)
+
P
D
R
th j a
Rev. 02 — 11 February 2009
–
Conditions
per supply pin
per ground pin
< (1.5V
T
based on package
heat transfer, not
device power
consumption
human body
model; all pins
(0.5V
j
< 125 C
DD(3V3)
DD(3V3)
) < V
j
[1]
);
( C), can be calculated using the following
I
DD
32-bit ARM Cortex-M3 microcontroller
and V
LPC1768/66/65/64
[4]
[4]
[5]
[6]
Min
-
-
-
-
65
2000
DD
. The I/O power dissipation of
Max
100
100
100
+150
1.5
+2000
© NXP B.V. 2009. All rights reserved.
SS
unless
Unit
mA
mA
mA
W
V
C
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