ADSP-BF538BBCZ-5F4 Analog Devices Inc, ADSP-BF538BBCZ-5F4 Datasheet - Page 25

• Manufacturer Part Number: ADSP-BF538BBCZ-5F4
• Description: IC, FLOAT-PT DSP, 16BIT, 533MHZ, BGA-316
• Manufacturer: Analog Devices Inc
• Series: Blackfinr
• Type: Fixed Pointr

Specifications of ADSP-BF538BBCZ-5F4

• No. Of Bits: 16 Bit
• Frequency: 533MHz
• Supply Voltage: 1.25V
• Embedded Interface Type: CAN, I2C, PPI, SPI, TWI, UART
• No. Of I/o's: 54
• Flash Memory Size: 512KB
• Interface: CAN, SPI, SSP, TWI, UART
• Clock Rate: 533MHz
• Non-volatile Memory: FLASH (512 kB)
• On-chip Ram: 148kB
• Voltage - I/o: 3.00V, 3.30V
• Voltage - Core: 1.25V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 316-CSPBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: ADZS-BFAUDIO-EZEXT - BOARD EVAL AUDIO BLACKFIN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

ELECTRICAL CHARACTERISTICS
1
2
3
4
5
6
7
8
9
System designers should refer to Estimating Power for the
ADSP-BF538/BF539 Blackfin Processors (EE-298), which pro-
vides detailed information for optimizing designs for lowest
power. All topics discussed in this section are described in detail
in EE-298. Total power dissipation has two components:
Many operating conditions can also affect power dissipation,
including temperature, voltage, operating frequency, and pro-
cessor activity.
current dissipation for internal circuitry (V
specifies static power dissipation as a function of voltage
(V
total power specification for the listed test conditions, including
the dynamic component as a function of voltage (V
frequency
Parameter
V
V
I
I
I
I
I
C
I
I
I
I
I
I
I
I
I
Specifications subject to change without notice.
Applies to output and bidirectional pins.
Applies to input pins except JTAG inputs.
Applies to JTAG input pins (TCK, TDI, TMS, TRST).
Applies to three-statable pins.
Applies to all signal pins.
Guaranteed, but not tested.
See the ADSP-BF538/538F Blackfin Processor Hardware Reference for definitions of sleep, deep sleep, and hibernate operating modes.
See
IH
IHP
IL
OZH
OZL
DDDEEPSLEEP
DDSLEEP
DD-TYP
DD-TYP
DD-TYP
DDHIBERNATE
DDRTC
DDDEEPSLEEP
DDINT
OH
OL
IN
1. Static, including leakage current
2. Dynamic, due to transistor switching characteristics
DDINT
Table 16
9
) and temperature (see
8
8
8
(Table
for the list of I
1
High Level Output Voltage
Low Level Output Voltage
High Level Input Current
High Level Input Current JTAG
Low Level Input Current
Three-State Leakage Current
Three-State Leakage Current
Input Capacitance
V
V
V
V
V
V
V
V
V
Electrical Characteristics on Page 25
DDINT
DDINT
DDINT
DDINT
DDINT
DDEXT
DDRTC
DDINT
DDINT
17).
Current in Deep Sleep Mode V
Current in Sleep Mode
Current
Current
Current
Current in Deep Sleep Mode f
Current
Current in Hibernate State
Current
DDINT
power vectors covered by various Activity Scaling Factors (ASF).
Table
6, 7
15), and I
3
3
2
2
5
5
DDINT
4
DDINT
). I
Test Conditions
V
V
V
V
V
V
V
f
ASF = 0.00
V
V
V
V
V
voltage regulator off (V
V
f
CCLK
CCLK
CCLK
DDDEEPSLEEP
specifies the
DDINT
DDEXT
DDEXT
DDEXT
DDEXT
DDEXT
DDEXT
DDEXT
DDINT
DDINT
DDINT
DDINT
DDINT
DDEXT
DDRTC
shows the
Rev. D | Page 25 of 56 | July 2010
= 1 MHz, T
= 0 MHz
> 0 MHz
= Maximum, V
= 1.0 V, f
= 0.8 V, T
= 1.14 V, f
= 1.2 V, f
= 1.2 V, f
= +3.0 V, I
= 3.0 V, I
= Maximum, V
= Maximum, V
= Maximum, V
= Maximum, V
= 3.6 V, CLKIN=0 MHz, T
) and
= 3.3 V, T
CCLK
CCLK
CCLK
OL
J
AMBIENT
J
CCLK
= 25°C, SCLK = 25 MHz
OH
= 25°C
= 2.0 mA
= 0 MHz, T
= 500 MHz, T
= 533 MHz, T
= –0.5 mA
= 400 MHz, T
IN
IN
IN
IN
IN
= 25°C, V
= V
= V
= 0 V
= V
= 0 V
DDINT
The dynamic component is also subject to an Activity Scaling
Factor (ASF) which represents application code running on the
processor
DD
DD
DD
= 0 V)
Maximum
Maximum
Maximum
J
= 25°C,
IN
J
J
J
= Max,
= 2.5 V
= 25°C
= 25°C
J
= 25°C
(Table
16).
ADSP-BF538/ADSP-BF538F
Min
2.4
4
7.5
130
50
20
6
Typ
168
180
Max
0.4
10.0
50.0
10.0
10.0
10.0
8
10
100
Table 15
I
(Table 17
DDDEEPSLEEP
× ASF)
+
Unit
V
V
μA
μA
μA
μA
μA
pF
mA
mA
mA
mA
mA
μA
μA
mA
mA