ML610Q429-NNNTBZ03A7 Rohm Semiconductor, ML610Q429-NNNTBZ03A7 Datasheet - Page 432

• Manufacturer Part Number: ML610Q429-NNNTBZ03A7
• Description: MCU 8BIT 48K FLASH 128-TQFP
• Manufacturer: Rohm Semiconductor

Specifications of ML610Q429-NNNTBZ03A7

• Core Processor: nX-U8/100
• Core Size: 8-Bit
• Speed: 4.2MHz
• Connectivity: I²C, SSP, UART/USART
• Peripherals: LCD, Melody Driver, POR, PWM, WDT
• Number Of I /o: 20
• Program Memory Size: 48KB (24K x 16)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 1.1 V ~ 3.6 V
• Data Converters: A/D 2x12b, 2x24b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 70°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

• Bias
[ ] 1/3 bias or [ ] 1/4 bias
• Duty
[ ] ML610Q428: 1/1 ~ 1/24 duty
[ ] ML610Q429: 1/1 ~ 1/8 duty
• COM/SEG
[ ] ML610Q428: 24COM x 58SEG
[ ] ML610Q429_BXX: 8COM x 64SEG (SEG63 to SEG0:SEGMENT PORT)
[ ] ML610Q429_CXX: 8COM x 56SEG (SEG63 to SEG56:OUTPUT PORT、SEG55 to SEG0:SEGMENT PORT)
[ ] ML610Q429_DXX: 8COM x 48SEG (SEG63 to SEG48:OUTPUT PORT、SEG47 to SEG0:SEGMENT PORT)
[ ] ML610Q429_EXX: 8COM x 40SEG (SEG63 to SEG40:OUTPUT PORT、SEG39 to SEG0:SEGMENT PORT)
[ ] ML610Q429_FXX: 8COM x 32SEG (SEG63 to SEG32:OUTPUT PORT、SEG31 to SEG0:SEGMENT PORT))
• External capacitor
(1/3 bias)
[ ] Ca=1uF(connected to VL1 pin), [ ] Cb=1uF(connected to VL2 pin),
[ ] Cd=1uF(connected to VL4 pin),
[ ] C12=1uF（connected between C1 and C2 pin）, [ ] C34=1uF(connected between C3 and C4 pin)
(1/4 bias)
[ ] Ca=1uF(connected to VL1 pin), [ ] Cb=1uF(connected to VL2 pin),
[ ] Cc=1uF(connected to VL3 pin), [ ] Cd=1uF(connected to VL4 pin),
[ ] C12=1uF（connected between C1 and C2 pin）, [ ] C34=1uF(connected between C3 and C4 pin)
Chapter 25 BLD (Battery Low Detector)
• Changing the threshold
[ ] Please select the threshold voltage when the BLD circuit is OFF.
Chapter 26 Power circuit
• External capacitor
[ ] CL0=1uF （connected to VDDL pin）,
Chapter 27 On-chip debug
[ ] Supply 3.0V ~ 3.6V to VDD pin when programming (erasing and writing) the Flash ROM with Oki semiconductor
development tool uEASE.
[ ] Please do not apply LSIs being used for debugging to mass production.
[ ] Please validate the ROM code on your production board without Oki semiconductor development tool uEASE.
Appendix A SFR (Specific Function Registers)
• Initial data
[ ] Please confirm there are some SFRs have undefined initial value at reset (Refer to Appendix A in the user’s manual).
Appendix C Electrical Characteristics
• Operating temperature
[ ] -20’C to +70’C
• Operating voltage vs Operating frequency
[ ] Please confirm the operating conditions.
Chapter 24 LCD driver
[ ] +1.1V to +3.6V (0kHz to 36kHz: Low-speed crystal oscillation clock operation)
[ ] +1.3V to +3.6V (30kHz to 625kHz: Built-in RC oscillation clock operation)
[ ] +1.8V to +3.6V (30kHz to 4.2MHz: High-speed crystal/ceramic oscillation clock or built-in PLL oscillation clock)
XX: ROM code number
[ ] Cx =0.1uF (connected to VDDX pin）
E – 4
ML610Q428/ML610Q429 User’s Manual
Appendix E Check List