ML610Q429-NNNTBZ03A7 Rohm Semiconductor, ML610Q429-NNNTBZ03A7 Datasheet - Page 13

• Manufacturer Part Number: ML610Q429-NNNTBZ03A7
• Description: MCU 8BIT 48K FLASH 128-TQFP
• Manufacturer: Rohm Semiconductor

Specifications of ML610Q429-NNNTBZ03A7

• Core Processor: nX-U8/100
• Core Size: 8-Bit
• Speed: 4.2MHz
• Connectivity: I²C, SSP, UART/USART
• Peripherals: LCD, Melody Driver, POR, PWM, WDT
• Number Of I /o: 20
• Program Memory Size: 48KB (24K x 16)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 1.1 V ~ 3.6 V
• Data Converters: A/D 2x12b, 2x24b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 70°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Chapter 25
Chapter 26
Chapter 27
Appendixes
Revision History
25. Battery Level Detector.................................................................................................................................. 25-1
26. Power Supply Circuit.................................................................................................................................... 26-1
27. On-Chip Debug Function.............................................................................................................................. 27-1
Appendix A Registers......................................................................................................................................... A-1
Appendix B Package Dimensions........................................................................................................................B-1
Appendix C Electrical Characteristics .................................................................................................................C-1
Appendix D Application Circuit Example.......................................................................................................... D-1
Appendix E Check List........................................................................................................................................E-1
Revision History .....................................................................................................................................................R-1
24.3 Description of Operation......................................................................................................................... 24-39
25.1 Overview................................................................................................................................................... 25-1
25.2 Description of Registers............................................................................................................................ 25-2
25.3 Description of Operation........................................................................................................................... 25-5
26.1 Overview................................................................................................................................................... 26-1
26.2 Description of Operation........................................................................................................................... 26-2
27.1 Overview................................................................................................................................................... 27-1
27.2 Method of Connecting to On-Chip Debug Emulator ................................................................................ 27-1
27.3 Flash Memory Rewrite Function .............................................................................................................. 27-2
24.2.10 Segout Data Registers 0 (SEGOUT0)............................................................................................. 24-35
24.2.11 Segout Data Registers 1 (SEGOUT1)............................................................................................. 24-36
24.2.12 Segout Data Registers 2 (SEGOUT2)............................................................................................. 24-37
24.2.13 Segout Data Registers 3 (SEGOUT3)............................................................................................. 24-38
24.3.1
24.3.2
24.3.3
24.3.4
24.3.5
24.3.6
25.1.1
25.1.2
25.2.1
25.2.2
25.2.3
25.3.1
25.3.2
26.1.1
26.1.2
26.1.3
Operation of LCD Drivers and Bias Generation Circuit................................................................. 24-39
Segment Mapping When the Programmable Display Allocation Function is Not Used ................ 24-40
Segment Mapping When the Programmable Display Allocation Function is Used ....................... 24-41
Common Output Waveforms .......................................................................................................... 24-43
Segment Output Waveform ............................................................................................................ 24-45
The change of the segment port and the general-purpose output port by a mask option ................ 24-51
Features............................................................................................................................................. 25-1
Configuration .................................................................................................................................... 25-1
List of Registers ................................................................................................................................ 25-2
Battery Level Detector Control Register 0 (BLDCON0).................................................................. 25-3
Battery Level Detector Control Register 1 (BLDCON1).................................................................. 25-4
Threshold Voltage............................................................................................................................. 25-5
Operation of Battery Level Detector................................................................................................. 25-6
Features............................................................................................................................................. 26-1
Configuration .................................................................................................................................... 26-1
List of Pins........................................................................................................................................ 26-1
Contents – 9
ML610Q428/ML610Q429 User’s Manual
Contents