FIN210ACMLX Fairchild Semiconductor, FIN210ACMLX Datasheet - Page 15

• Manufacturer Part Number: FIN210ACMLX
• Description: IC SER/DES 10BIT 32-MLP
• Manufacturer: Fairchild Semiconductor

Specifications of FIN210ACMLX

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Physical Dimensions
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recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty
therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/.
© 2009 Fairchild Semiconductor Corporation
FIN210AC • Rev. 1.0.3
Order Number
FIN210ACMLX
For Fairchild’s definition of Eco Status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html.
(DATUM B)
PIN #1 IDENT
NOTES:
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M-1994.
D. LAND PATTERN PER IPC SM-782.
E. WIDTH REDUCED TO AVOID SOLDER BRIDGING.
F. DIMENSIONS ARE NOT INCLUSIVE OF BURRS, MOLD FLASH, OR
G. DRAWING FILENAME: MKT-MLP32Arev3.
A. CONFORMS TO JEDEC REGISTRATION MO-220, VARIATION
PIN #1 IDENT
Temperature Range
0.08 C
WHHD-4. THIS PACKAGE IS ALSO FOOTPRINT COMPATIBLE WITH
WHHD-5.
TIE BAR PROTRUSIONS.
0.10 C
SEATING
PLANE
0.15 C
0.05
0.00
Operating
0.50
-30 to 70°C
0.80 MAX
0.50
Figure 9. 32-Lead, Molded Leadless Package (MLP)
5.00
3.70
3.50
32-Terminal Molded Leadless Package (MLP),
Quad, JEDEC MO-220, 5mm Square
0.18-0.30
B
5.00
3.70
3.50
Package Description
(0.20)
0.45
0.35
A
0.10
0.05
C
(DATUM A)
0.15 C
C A B
C
15
5.38 MIN
3.86 MIN
0.28 MAX
PIN #1 ID
PIN #1 ID
X40
E
0.50TYP
Eco Status
Green
(0.76)
0.20MIN
X4
3.37 MAX
(0.25 )
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Tape & Reel
Packing
Method