SAK-TC1796-256F150E BC Infineon Technologies, SAK-TC1796-256F150E BC Datasheet - Page 130

• Manufacturer Part Number: SAK-TC1796-256F150E BC
• Description: IC MCU 32BIT FLASH BGA-416
• Manufacturer: Infineon Technologies
• Series: TC17xxr

Specifications of SAK-TC1796-256F150E BC

• Core Processor: TriCore
• Core Size: 32-Bit
• Speed: 150MHz
• Connectivity: ASC, CAN, EBI/EMI, MLI, MSC, SSC
• Peripherals: DMA, POR, WDT
• Number Of I /o: 123
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• Ram Size: 256K x 8
• Voltage - Supply (vcc/vdd): 1.42 V ~ 1.58 V
• Data Converters: A/D 44x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 416-BGA
• Data Bus Width: 32 bit
• Data Ram Size: 256 KB
• Interface Type: 2xASC, 2xSSC, 2xMSC, 2xMLI
• Maximum Clock Frequency: 150 MHz
• Number Of Programmable I/os: 123
• Number Of Timers: 260
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8 bit, 10 bit, 12 bit, 44 Channel
• Packages: P-BGA-416
• Max Clock Frequency: 150.0 MHz
• Sram (incl. Cache): 256.0 KByte
• Can Nodes: 4
• A / D Input Lines (incl. Fadc): 44
• Program Memory: 2.0 MB
• For Use With: B158-H8537-G2-X-7600IN - KIT STARTER TC179X FAMILY
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: No
• Other names: SAKTC1796256F150EBCT; SP000097527; SP000097528

5
5.1
Table 35
Parameter
Thermal resistance junction
case top
Thermal resistance junction
case bottom
1) The top and bottom thermal resistances between the case and the ambient (
Data Sheet
with the thermal resistances between the junction and the case given above (
the total thermal resistance between the junction and the ambient (
case and the ambient (
user responsibility.
The junction temperature can be calculated using the following equation:
is the total thermal resistance between the junction and the ambient. This total junction ambient resistance
can be obtained from the upper four partial thermal resistances.
1)
Package and Reliability
Package Parameters (P/PG-BGA-416-4)
1)
Thermal Characteristics of the Package
R
TCAT
,
R
TCAB
Symbol
R
R
) depend on the external system (PCB, case) characteristics, and are under
TJCT
TJCB
CC –
CC –
Min.
130
Typ.
Values
R
TJA
). The thermal resistances between the
Max.
8
15
T
J
R
R
Package and Reliability
=
TJCT
TCAT
T
A
,
,
+
R
R
R
TJCB
TCAB
Unit Note /
K/W –
K/W –
TJA
), in order to calculate
) are to be combined
×
P
D
V1.0, 2008-04
Test Condi
tion
, where the
TC1796
R
R
TJA
TJA