MCF5208CAB166 Freescale Semiconductor, MCF5208CAB166 Datasheet - Page 25

MCU 32BIT 166.67MHZ 160-QFP

MCF5208CAB166

Manufacturer Part Number
MCF5208CAB166
Description
MCU 32BIT 166.67MHZ 160-QFP
Manufacturer
Freescale Semiconductor
Series
MCF520xr
Datasheet

Specifications of MCF5208CAB166

Core Processor
Coldfire V2
Core Size
32-Bit
Speed
166.67MHz
Connectivity
EBI/EMI, Ethernet, I²C, SPI, UART/USART
Peripherals
DMA, WDT
Number Of I /o
50
Program Memory Type
ROMless
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
1.4 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
160-QFP
Family Name
MCF5xxx
Device Core
ColdFire
Device Core Size
32b
Frequency (max)
166.67MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
1.8/2.5/3.3V
Operating Supply Voltage (max)
1.6/1.95/2.75/3.6V
Operating Supply Voltage (min)
1.4/1.7/2.25/3V
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
160
Package Type
PQFP
Processor Series
MCF520x
Core
ColdFire V2
3rd Party Development Tools
JLINK-CF-BDM26, EWCF
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCF5208CAB166
Manufacturer:
SANREX
Quantity:
210
Part Number:
MCF5208CAB166
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
5.7
Table 11
Freescale Semiconductor
NOTES:
1
2
3
4
5
6
7
8
9
10
11
Num
The maximum allowable input clock frequency when booting with the PLL enabled is 24 MHz. For higher input clock
frequencies, the processor must boot in LIMP mode to avoid violating the maximum allowable CPU frequency.
All internal registers retain data at 0 Hz.
This parameter is guaranteed by characterization before qualification rather than 100% tested.
Proper PC board layout procedures must be followed to achieve specifications.
This parameter is guaranteed by design rather than 100% tested.
This specification is the PLL lock time only and does not include oscillator start-up time.
C
Jitter is the average deviation from the programmed frequency measured over the specified interval at maximum f
Measurements are made with the device powered by filtered supplies and clocked by a stable external clock signal.
Noise injected into the PLL circuitry via PLL V
the Cjitter percentage for a given interval.
Values are with frequency modulation disabled. If frequency modulation is enabled, jitter is the sum of Cjitter+Cmod.
Modulation percentage applies over an interval of 10μs, or equivalently the modulation rate is 100KHz.
10
11
12
13
14
17
18
19
Modulation range determined by hardware design.
9
PCB_EXTAL
lists processor bus input timings.
External Interface Timing Characteristics
XTAL Current
Total on-chip stray capacitance on XTAL
Total on-chip stray capacitance on EXTAL
Crystal capacitive load
Discrete load capacitance for XTAL
Discrete load capacitance for EXTAL
CLKOUT Period Jitter,
Frequency Modulation Range Limit
(f
VCO Frequency. f
sys
Peak-to-peak Jitter (Clock edge to clock edge)
Long Term Jitter
Max must not be exceeded)
All processor bus timings are synchronous; that is, input setup/hold and
output delay with respect to the rising edge of a reference clock. The
reference clock is the FB_CLK output.
and C
PCB_XTAL
vco
Table 10. PLL Electrical Characteristics (continued)
= (f
Characteristic
are the measured PCB stray capacitances on EXTAL and XTAL, respectively.
MCF5208 ColdFire
3, 4, 7, 8, 9
ref *
PFD)/4
Measured at f
3, 10, 11
DD
®
, EV
Microprocessor Data Sheet, Rev. 3
DD
SYS
NOTE
, and V
Max
SS
and variation in crystal oscillator frequency increase
C
C
Symbol
C
C
S_EXTAL
L_EXTAL
I
C
C
S_XTAL
L_XTAL
XTAL
f
C
vco
jitter
mod
L
Value
Min.
350
0.8
1
C
Electrical Characteristics
C
See crystal
C
PCB_EXTAL
C
PCB_XTAL
S_EXTAL
2*C
S_XTAL
2*C
Value
Max.
spec
TBD
540
1.5
1.5
2.2
10
3
L
L
-
-
-
-
7
7
% f
% f
%f
MHz
Unit
mA
pF
pF
pF
pF
sys/2
sys/2
sys/2
sys
.
25

Related parts for MCF5208CAB166