MCF5208CAB166 Freescale Semiconductor, MCF5208CAB166 Datasheet - Page 20

• Manufacturer Part Number: MCF5208CAB166
• Description: MCU 32BIT 166.67MHZ 160-QFP
• Manufacturer: Freescale Semiconductor
• Series: MCF520xr

Specifications of MCF5208CAB166

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 166.67MHz
• Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART
• Peripherals: DMA, WDT
• Number Of I /o: 50
• Program Memory Type: ROMless
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 1.4 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 160-QFP
• Family Name: MCF5xxx
• Device Core: ColdFire
• Device Core Size: 32b
• Frequency (max): 166.67MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.8/2.5/3.3V
• Operating Supply Voltage (max): 1.6/1.95/2.75/3.6V
• Operating Supply Voltage (min): 1.4/1.7/2.25/3V
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 160
• Package Type: PQFP
• Processor Series: MCF520x
• Core: ColdFire V2
• 3rd Party Development Tools: JLINK-CF-BDM26, EWCF
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Compliant

Electrical Characteristics
5.4
20
Core Supply Voltage
PLL Supply Voltage
CMOS Pad Supply Voltage
SDRAM and FlexBus Supply Voltage
CMOS Input High Voltage
CMOS Input Low Voltage
CMOS Output High Voltage
CMOS Output Low Voltage
SDRAM and FlexBus Input High Voltage
SDRAM and FlexBus Input Low Voltage
SDRAM and FlexBus Output High Voltage
SDRAM and FlexBus Output Low Voltage
Input Leakage Current
Mobile DDR/Bus Pad Supply Voltage (nominal 1.8V)
DDR/Bus Pad Supply Voltage (nominal 2.5V)
SDR/Bus Pad Supply Voltage (nominal 3.3V)
I
I
Mobile DDR/Bus Input High Voltage (nominal 1.8V)
DDR/Bus Pad Supply Voltage (nominal 2.5V)
SDR/Bus Pad Supply Voltage (nominal 3.3V)
Mobile DDR/Bus Input High Voltage (nominal 1.8V)
DDR/Bus Pad Supply Voltage (nominal 2.5V)
SDR/Bus Pad Supply Voltage (nominal 3.3V)
Mobile DDR/Bus Input High Voltage (nominal 1.8V)
DDR/Bus Pad Supply Voltage (nominal 2.5V)
SDR/Bus Pad Supply Voltage (nominal 3.3V)
I
Mobile DDR/Bus Input High Voltage (nominal 1.8V)
DDR/Bus Pad Supply Voltage (nominal 2.5V)
SDR/Bus Pad Supply Voltage (nominal 3.3V)
I
DC Electrical Specifications
OH
OL
OH
OL
V
in
= 5.0 mA
= 5.0 mA for all modes
= –5.0 mA
= –5.0 mA for all modes
= IV
2
DD
A device is defined as a failure if, after exposure to ESD pulses, the device no longer
meets the device specification requirements. Complete DC parametric and functional
testing is performed per applicable device specification at room temperature followed by
hot temperature, unless specified otherwise in the device specification.
or V
SS
, Input-only pins
Characteristic
MCF5208 ColdFire
Table 7. DC Electrical Specifications
®
Microprocessor Data Sheet, Rev. 3
Symbol
PLLV
SDV
SDV
SDV
SDV
SDV
EV
EV
EV
IV
EV
EV
I
in
DD
OH
DD
OL
IH
IL
DD
OH
OL
DD
IH
IL
SDV
EV
V
V
V
V
SS
SS
SS
SS
DD
1.70
2.25
1.35
DD
–1.0
Min
1.4
1.4
3.0
3.0
1.7
2.1
2.4
—
—
—
—
2
2
- 0.3
- 0.3
- 0.3
- 0.3
- 0.4
- 0.35
SDV
SDV
SDV
EV
DD
Max
1.95
2.75
0.45
DD
DD
DD
Freescale Semiconductor
1.6
1.6
3.6
3.6
0.8
0.4
0.8
0.8
0.3
0.3
0.5
1.0
—
—
—
—
+ 0.3
+ 0.3
+ 0.3
+ 0.3
Unit
μA
V
V
V
V
V
V
V
V
V
V
V
V