MC56F8011VFAE Freescale Semiconductor, MC56F8011VFAE Datasheet - Page 120

• Manufacturer Part Number: MC56F8011VFAE
• Description: IC DIGITAL SIGNAL CTLR 32-LQFP
• Manufacturer: Freescale Semiconductor
• Series: 56F8xxxr

Specifications of MC56F8011VFAE

• Core Processor: 56800
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 26
• Program Memory Size: 12KB (6K x 16)
• Program Memory Type: FLASH
• Ram Size: 1K x 16
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 6x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 32-LQFP
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: MC56F80xx
• Core: 56800E
• Numeric And Arithmetic Format: Fixed-Point
• Device Million Instructions Per Second: 32 MIPs
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 26
• Data Ram Size: 2 KB
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: MC56F8037EVM, DEMO56F8014-EE, DEMO56F8013-EE
• Interface Type: SCI, SPI, I2C
• Minimum Operating Temperature: - 40 C
• For Use With: CPA56F8013 - BOARD SOCKET FOR MC56F8013APMOTOR56F8000E - KIT DEMO MOTOR CTRL SYSTEM
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

120
SEATING
PLANE
9
B
C
–AB–
–AC–
B1
E
–T–
Figure 11-2 56F8013/56F8011 32-Pin LQFP Mechanical Information
H
8
1
8X
M
DETAIL AD
32
W
9
S1
A1
G
A
S
0.10 (0.004) AC
DETAIL Y
X
–Z–
25
K
56F8013/56F8011 Data Sheet, Rev. 12
R
4X
17
4X
Q
0.20 (0.008)
–U–
0.20 (0.008)
V1
DETAIL AD
V
AB
AC
T–U
SECTION AE–AE
F
É É É É
É É
É É
T–U
METAL
BASE
Z
J
N
Z
D
P
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
5. DIMENSIONS S AND V TO BE DETERMINED AT
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
7. DIMENSION D DOES NOT INCLUDE DAMBAR
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
9. EXACT SHAPE OF EACH CORNER MAY VARY
Y14.5M, 1982.
OF LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
AT DATUM PLANE –AB–.
SEATING PLANE –AC–.
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.520 (0.020).
0.0076 (0.0003).
FROM DEPICTION.
DIM
A1
B1
S1
V1
W
A
B
C
D
E
G
H
K
M
N
P
Q
R
S
V
X
F
J
1.400
0.300
1.350
0.300
0.050
0.090
0.500
0.090
0.150
MILLIMETERS
MIN
DETAIL Y
7.000 BSC
3.500 BSC
7.000 BSC
3.500 BSC
0.800 BSC
0.400 BSC
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
12 REF
1
1.600
0.450
1.450
0.400
0.150
0.200
0.700
0.160
0.250
MAX
Freescale Semiconductor
5
0.055
0.012
0.053
0.012
0.002
0.004
0.020
0.004
0.006
MIN
0.276 BSC
0.138 BSC
0.276 BSC
0.138 BSC
0.031 BSC
0.016 BSC
0.354 BSC
0.177 BSC
0.354 BSC
0.177 BSC
0.008 REF
0.039 REF
1
12 REF
INCHES
AE
AE
0.063
0.018
0.057
0.016
0.006
0.008
0.028
0.006
0.010
MAX
5