LPC2939FBD208,551 NXP Semiconductors, LPC2939FBD208,551 Datasheet - Page 92

• Manufacturer Part Number: LPC2939FBD208,551
• Description: IC ARM9 MCU FLASH 768KB 208-LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2900r

Specifications of LPC2939FBD208,551

• Core Processor: ARM9
• Core Size: 32-Bit
• Speed: 125MHz
• Connectivity: CAN, EBI/EMI, I²C, LIN, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 152
• Program Memory Size: 768KB (768K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 16K x 8
• Ram Size: 56K x 8
• Voltage - Supply (vcc/vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 24x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 208-LQFP
• Processor Series: LPC29
• Core: ARM968E-S
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: OM11027
• Package: 208LQFP
• Device Core: ARM968E-S
• Family Name: LPC2900
• Operating Supply Voltage: 1.8|3.3 V
• Data Bus Width: 16|32 Bit
• Number Of Programmable I/os: 160
• Interface Type: CAN/I2C/LIN/QSPI/UART/USB
• On-chip Adc: 24-chx10-bit
• Number Of Timers: 6
• For Use With: 568-4787 - BOARD EVAL LPC2939
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935287113551

NXP Semiconductors
LPC2939_3
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
Fig 41. Temperature profiles for large and small components
temperature
MSL: Moisture Sensitivity Level
All information provided in this document is subject to legal disclaimers.
Rev. 03 — 7 April 2010
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
ARM9 microcontroller with CAN, LIN, and USB
temperature
peak
LPC2939
© NXP B.V. 2010. All rights reserved.
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