DSPIC30F2010-20I/SP Microchip Technology, DSPIC30F2010-20I/SP Datasheet - Page 6

IC DSPIC MCU/DSP 12K 28DIP

DSPIC30F2010-20I/SP

Manufacturer Part Number
DSPIC30F2010-20I/SP
Description
IC DSPIC MCU/DSP 12K 28DIP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr

Specifications of DSPIC30F2010-20I/SP

Program Memory Type
FLASH
Program Memory Size
12KB (4K x 24)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
20
Eeprom Size
1K x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC30F
Core
dsPIC
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
20
Data Ram Size
512 B
Operating Supply Voltage
2.5 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Data Rom Size
1024 B
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300027, DM330011, DM300018, DM183021
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
DSPIC30F2010-20I/SPG
DSPIC30F201020ISG
DSPIC30F201020ISG
DSPIC30F201020ISP

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F2010-20I/SP
Manufacturer:
MAXIM
Quantity:
6
Part Number:
DSPIC30F2010-20I/SP
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
dsPIC30F2010
Table of Contents
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
9.0
10.0 Timer2/3 Module ........................................................................................................................................................................ 61
11.0 Input Capture Module................................................................................................................................................................. 67
12.0 Output Compare Module ............................................................................................................................................................ 71
13.0 Quadrature Encoder Interface (QEI) Module ............................................................................................................................. 75
14.0 Motor Control PWM Module ....................................................................................................................................................... 81
15.0 SPI™ Module ............................................................................................................................................................................. 91
16.0 I2C Module ................................................................................................................................................................................. 95
17.0 Universal Asynchronous Receiver Transmitter (UART) Module .............................................................................................. 103
18.0 10-bit High Speed Analog-to-Digital Converter (A/D) Module .................................................................................................. 111
19.0 System Integration ................................................................................................................................................................... 119
20.0 Instruction Set Summary .......................................................................................................................................................... 133
21.0 Development Support............................................................................................................................................................... 141
22.0 Electrical Characteristics .......................................................................................................................................................... 147
23.0 Packaging Information.............................................................................................................................................................. 187
On-Line Support................................................................................................................................................................................. 197
Systems Information and Upgrade Hot Line ...................................................................................................................................... 197
Reader Response .............................................................................................................................................................................. 198
Product Identification System............................................................................................................................................................. 199
DS70118D-page 4
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Device Overview .......................................................................................................................................................................... 5
CPU Architecture Overview.......................................................................................................................................................... 9
Memory Organization ................................................................................................................................................................. 19
Address Generator Units ............................................................................................................................................................ 31
Interrupts .................................................................................................................................................................................... 37
Flash Program Memory .............................................................................................................................................................. 43
Data EEPROM Memory ............................................................................................................................................................. 49
I/O Ports ..................................................................................................................................................................................... 53
Timer1 Module ........................................................................................................................................................................... 57
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Preliminary
 2004 Microchip Technology Inc.

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