DSPIC30F2010-20I/SP Microchip Technology, DSPIC30F2010-20I/SP Datasheet - Page 14

• Manufacturer Part Number: DSPIC30F2010-20I/SP
• Description: IC DSPIC MCU/DSP 12K 28DIP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F2010-20I/SP

• Program Memory Type: FLASH
• Program Memory Size: 12KB (4K x 24)
• Package / Case: 28-DIP (0.300", 7.62mm)
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 20 MIPS
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 20
• Eeprom Size: 1K x 8
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC30F
• Core: dsPIC
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 20
• Data Ram Size: 512 B
• Operating Supply Voltage: 2.5 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Data Rom Size: 1024 B
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300027, DM330011, DM300018, DM183021
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: DSPIC30F2010-20I/SPG; DSPIC30F201020ISG; DSPIC30F201020ISG; DSPIC30F201020ISP

dsPIC30F2010
2.3
The dsPIC devices feature a 16/16-bit signed fractional
divide operation, as well as 32/16-bit and 16/16-bit
signed and unsigned integer divide operations, in the
form of single instruction iterative divides. The following
instructions and data sizes are supported:
1.
2.
3.
4.
5.
The 16/16 divides are similar to the 32/16 (same number
of iterations), but the dividend is either zero-extended or
sign-extended during the first iteration.
TABLE 2-1:
DS70118D-page 12
DIVF
DIV.sd
DIV.sw (or DIV.s)
DIV.ud
DIV.uw (or DIV.u)
DIVF – 16/16 signed fractional divide
DIV.sd – 32/16 signed divide
DIV.ud – 32/16 unsigned divide
DIV.sw – 16/16 signed divide
DIV.uw – 16/16 unsigned divide
Divide Support
Instruction
DIVIDE INSTRUCTIONS
Signed fractional divide: Wm/Wn → W0; Rem → W1
Signed divide: (Wm+1:Wm)/Wn → W0; Rem → W1
Signed divide: Wm/Wn → W0; Rem → W1
Unsigned divide: (Wm+1:Wm)/Wn → W0; Rem → W1
Unsigned divide: Wm/Wn → W0; Rem → W1
Preliminary
The divide instructions must be executed within a
REPEAT loop. Any other form of execution (e.g. a
series of discrete divide instructions) will not function
correctly because the instruction flow depends on
RCOUNT. The divide instruction does not automatically
set up the RCOUNT value, and it must, therefore, be
explicitly and correctly specified in the REPEAT instruc-
tion, as shown in Table 2-1 (REPEAT will execute the
target instruction {operand value+1} times). The
REPEAT loop count must be set up for 18 iterations of
the DIV/DIVF instruction. Thus, a complete divide
operation requires 19 cycles.
Note:
Function
The Divide flow is interruptible. However,
the user needs to save the context as
appropriate.
 2004 Microchip Technology Inc.